Modular Sub-Array Camera Modules for Wafer Space Efficiency
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Solution Overview
Problem
The manufacturing of one-dimensional array cameras is challenging due to the elongated nature of their components, which does not optimize wafer space, and they require complex processing and memory for parallax disparity resolution, making them difficult to produce and integrate into devices like smartphones.
Innovation Solution
The use of modular sub-array modules, each with a 1×N arrangement of focal planes and lens stacks, allows for efficient use of wafer space and simplifies processing by enabling sub-pixel shifted views of a scene, facilitating the construction of array cameras with improved manufacturing yield and reduced processing requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional array cameras use elongated components to achieve 1×N arrangement, then sub-pixel shifted views can be captured, but wafer space utilization deteriorates and manufacturing complexity increases
Solution Approach 1:
The patent segments the array camera into multiple independent 1×1 camera modules, each capturing images from slightly different angles. These modular units can be arranged in a 1×N configuration without requiring elongated components, as each module is self-contained and can be manufactured separately on standard wafers, improving wafer space utilization while maintaining the ability to capture sub-pixel shifted views.
Solution Approach 2:
Instead of achieving the 1×N arrangement through elongation in one dimension, the patent uses stacking or planar arrangement of multiple 1×1 modules, transitioning from a single elongated structure to a multi-dimensional modular configuration. This allows compact packaging on standard wafers while preserving the angular diversity needed for sub-pixel shifted view capture.
2Measurement precision
If complex processing and memory are used for parallax disparity resolution, then image quality improves, but device complexity and processing requirements increase
Solution Approach 1:
The patent captures images from multiple angles that provide slightly more information than the minimum required for parallax disparity resolution. By having each 1×1 module capture images from unique angles, the system obtains redundant data that simplifies the processing needed for accurate depth estimation and 3D reconstruction, reducing the computational burden compared to minimal configurations.
Solution Approach 2:
The patent performs preliminary organization and preprocessing of images from multiple 1×1 modules before final parallax disparity resolution. Images are captured and initially structured according to their angular relationships, with metadata about each module's orientation preserved. This preliminary structuring simplifies subsequent processing by pre-organizing data in a manner optimized for parallax calculation, reducing the complexity of final image fusion and depth mapping operations.
Data Source
AI summary
Systems and methods in accordance with embodiments of the invention implement one-dimensional array cameras, as well as modular array cameras using sub-array modules. In one embodiment, a 1×N array camera module includes: a 1×N arrangement of focal planes, where N is greater than or equal to 2, each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane not including pixels from another focal plane; and a 1×N arrangement of lens stacks, the arrangement of lens stacks being disposed relative to the arrangement of focal planes so as to form a 1×N arrangement of cameras, each configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to that of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.