Modular Submodule Architecture for MMC Space Efficiency

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Solution Overview

Problem

The arrangement of half bridge-type and full bridge-type converter cells in modular multilevel converters (MMC) often results in low space efficiency due to size differences, particularly when only a few full bridge-type cells are used, necessitating a mixed arrangement that complicates packing.

Innovation Solution

The power conversion device employs submodules with standardized terminals and components, allowing half bridge-type cells to function as single units and full bridge-type cells to be formed by combining two submodules, thereby achieving uniform sizing and efficient packing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If half bridge-type converter cells and full bridge-type converter cells are arranged in a mixed manner in one tower, then the device can accommodate both cell types, but space efficiency deteriorates due to size differences between the cell types

Engineering Contradiction:
Improveability to accommodate both half bridge-type and full bridge-type converter cellsVSAvoidspace efficiency in tower arrangement
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The invention divides the converter cells into modular submodules that can be uniformly arranged. Each converter cell is segmented into multiple identical submodules (e.g., two submodules per cell), allowing standardized placement in the tower while maintaining the ability to form different cell types through modular combination.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The submodules are designed with universal characteristics - identical terminal arrangements and standardized interfaces - enabling them to serve multiple functions. The same submodule type can be used to construct both half bridge-type and full bridge-type converter cells, providing adaptability without sacrificing space efficiency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Area of stationary object

If converter cells are arranged in separate towers according to type, then space efficiency improves for each tower, but device complexity increases due to multiple tower structures

Engineering Contradiction:
Improvespace efficiency in tower arrangementVSAvoidnumber of towers and arrangement structure
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The invention merges the arrangement of different converter cell types into a single tower structure by using uniformly sized submodules. This allows half bridge-type and full bridge-type cells to coexist in the same tower space, reducing the number of towers needed while maintaining space efficiency through standardized submodule dimensions.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If only a few full bridge-type converter cells are used, then the device meets specific application requirements, but arrangement complexity increases due to the need for mixed configuration

Engineering Contradiction:
Improveflexibility in converter cell configurationVSAvoidarrangement complexity of mixed cell types
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

By segmenting converter cells into standardized submodules, the invention simplifies the arrangement process. Whether using mostly half bridge-type cells or mostly full bridge-type cells, the same modular approach applies, reducing arrangement complexity while maintaining flexibility in configuration ratios.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11159092B2Power conversion device
Publication Date: 2021.10.26 MITSUBISHI ELECTRIC CORP
  • US11159092B2 patent drawing
  • US11159092B2 patent drawing
  • US11159092B2 patent drawing

AI summary

A power conversion device according to one embodiment includes a plurality of submodules connected in series to each other. In each submodule, a first terminal, a second terminal and a third terminal are provided on or provided to protrude from a surface of a package. A first semiconductor switching element is built into the package and connected between the first terminal and the second terminal. A second semiconductor switching element is built into the package and connected between the second terminal and the third terminal. A DC capacitor is built into the package and connected between the first terminal and the third terminal.