Modular Substrate With Integrated Fuses For Configurable Interconnects
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Solution Overview
Problem
Current semiconductor packages lack true modularity, leading to wasted substrate real estate and increased costs due to unutilized areas and additional discrete components like switches.
Innovation Solution
The integration of fuses within the substrate layers during manufacturing, allowing for customizable connections by selectively blowing fuses post-manufacturing, enabling modular substrate designs without adding z-height or requiring additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete components like switches are used to provide modularity, then adaptability is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges the fuse functionality directly into the substrate layers, eliminating the need for separate discrete switch components. The conductive members are formed within the substrate's dielectric layers, integrating the modularity control mechanism into the substrate itself rather than adding external components.
Solution Approach 2:
The substrate structure is designed to serve multiple functions: it provides both the structural support and the modularity control through its integrated conductive members. The same substrate layers that provide electrical connectivity also contain the fuse mechanisms, making the substrate a multi-functional component that eliminates the need for separate switch components.
2Adaptability or versatility
If discrete components like switches are used to provide modularity, then adaptability is improved, but cost increases
Solution Approach 1:
The fuse functionality is merged into the substrate manufacturing process itself. The conductive members are formed using standard substrate fabrication techniques, and the fuse links are created as part of the same process flow, eliminating the need to purchase and assemble separate discrete switch components.
Solution Approach 2:
The fuse links are pre-formed during substrate manufacturing, ready for selective activation. The conductive members are prepared in advance with the fuse functionality already integrated, so that during final assembly only the selective blowing of fuses is needed to achieve the desired configuration, rather than assembling different switch components.
3Adaptability or versatility
If a large substrate with separate regions is used to connect different components, then adaptability is improved, but substrate area increases
Solution Approach 1:
The substrate is segmented into multiple functional regions with dedicated conductive members for different connection configurations. Each region contains fuse links that can be selectively activated to enable or disable specific connection paths, allowing a compact substrate to support multiple component configurations without requiring separate large regions for each possibility.
Solution Approach 2:
The substrate configuration is made dynamic through the fuse mechanism. Rather than requiring fixed separate regions for different configurations, the same substrate area can be dynamically reconfigured by selectively blowing fuses, allowing the connection topology to change based on which components are present without requiring additional substrate area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces costs and substrate size by allowing for multiple configurations using a unified generic design, enhancing tool utilization and modularity without increasing the substrate's form factor.
Implementation Method 1
The first conductive member provides modularity by disconnecting the first and second ports when a threshold voltage is applied between the first and second ports to cause the first conductive member to heat up to a melting point of the first conductive member
Implementation Method 2
The first conductive member that has melted is removed from the cavity
Data Source
AI summary
Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers, a cavity formed in at least one organic dielectric layer of the plurality of organic dielectric layers and a modular structure having first and second ports and a conductive member that is formed within the cavity. The conductive member provides modularity by being capable of connecting the first and second ports and also disconnecting the first and second ports.