Modular Substrate Processing System with Independent Chamber Control
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Solution Overview
Problem
Current semiconductor wafer processing systems have limitations in independently controlling dwell times at processing stations, leading to increased costs and reduced system availability due to the need for a large central zone and sequential processing, which hampers efficiency and flexibility.
Innovation Solution
A modular, linear substrate processing system with independently controlled processing chambers and a transport mechanism using a linkage arm system for linear and rotary motion, allowing for separate dwell times and redundancy, enabling continuous operation even if one station is down, with a focus on minimizing footprint and enhancing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large central zone is used for sequential wafer processing, then system availability is reduced and costs increase, but processing can be performed in a controlled environment
Solution Approach 1:
The system divides the processing equipment into modular processing stations that can be independently controlled and operated. Each station has its own vacuum environment, eliminating the need for a large central zone and enabling continuous operation even when one station is down for maintenance, thereby improving system availability while reducing overall footprint.
Solution Approach 2:
The system implements dynamic wafer transport where wafers can move independently through different processing stations at different times. The transport mechanism allows flexible routing and dwell time control at each station, enabling parallel processing operations that increase system availability without requiring a large central waiting area.
2Productivity
If wafers are processed sequentially one at a time, then system complexity is reduced, but productivity decreases
Solution Approach 1:
The transport system dynamically adjusts wafer movement and dwell times at each processing station independently. Multiple wafers can be in different stages of processing simultaneously, with the control system optimizing transport sequences to maximize throughput while managing the complexity through modular station design.
Solution Approach 2:
The system enables continuous wafer processing by eliminating idle time between processing steps. Wafers are continuously transported between stations without stopping, and multiple wafers can be processed in parallel at different stations, maintaining continuous productive action throughout the system.
3Adaptability or versatility
If processing chambers are sealed off from the central chamber, then contamination is prevented, but system flexibility is reduced
Solution Approach 1:
Each processing station is a sealed, independent vacuum chamber with its own controlled environment. This segmentation allows each station to be configured for specific processing requirements while maintaining vacuum integrity, enabling flexible process customization without compromising contamination control.
Solution Approach 2:
The system uses a controlled atmosphere transport mechanism that maintains vacuum separation between chambers while enabling wafer transfer. This intermediary transport system allows flexible configuration of processing stations while preventing contamination through maintained vacuum barriers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves flexible and efficient processing with independently controlled dwell times, reduced costs, and high system availability by allowing additional functional stations without significant size increases, while maintaining a small footprint and high throughput.
Implementation Method 1
a magnetic driver, the magnetic driver imparting a rotational motion to the magnetically-coupled follower across a vacuum partition
Implementation Method 2
A gas bearing arrangement movably supports the movable element relative to a stationary element. The gas bearing arrangement is configured to be operated under the negative pressure environment inside the chamber
Data Source
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AI summary
There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber 32 along the sides of processing chambers 31 for feeding substrates into a controlled atmosphere through a load lock 35 and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.