Modular Substrate Support Assemblies for Thermal Expansion Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor processing systems face challenges in efficiently accessing and maintaining elongated substrate supports within processing chambers, leading to difficulties in removal and potential damage to internal components.
Innovation Solution
The development of substrate support assemblies with modular design, including a platen, stem sections, and RF/thermocouple components, allowing for easier disassembly and accommodating thermal expansion, which facilitates the separation of substrate support sections and improves accessibility for maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If substrate support length is increased to accommodate elongated supports in processing chambers, then the support can span larger processing regions, but removal and maintenance becomes difficult
Solution Approach 1:
The substrate support is divided into multiple separable sections (first section, second section, third section) that can be detached from each other. This segmentation allows the elongated substrate support to be broken into manageable pieces for easy removal and maintenance, while still functioning as a complete long support during operation.
2Strength
If substrate support is made as a single integrated component, then structural integrity is maintained, but access for maintenance requires lifting entire chamber top section
Solution Approach 1:
The integrated substrate support is segmented into multiple sections with coupling mechanisms that maintain structural integrity during operation but allow easy separation for maintenance. The sections can be quickly disconnected without requiring chamber disassembly.
Solution Approach 2:
The coupling mechanisms between sections are designed to be extractable and removable, allowing individual sections to be taken out independently for maintenance or replacement without affecting the entire substrate support structure or requiring chamber top section removal.
3Stability of the object's composition
If RF rod and heater rod are rigidly coupled, then structural stability is improved, but thermal expansion causes stress and potential damage
Solution Approach 1:
A flexible coupling mechanism is used between the RF rod and heater rod that allows relative movement and thermal expansion while maintaining electrical and mechanical connections. This flexible coupling prevents stress buildup during thermal cycles.
Solution Approach 2:
The coupling mechanism between rods is designed to change its physical parameters (such as flexibility or expansion characteristics) in response to temperature changes, allowing the system to accommodate thermal expansion while maintaining structural stability and preventing damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables more efficient removal of substrate supports, reduces the risk of damage, and enhances the operational integrity of substrate support systems, allowing for improved maintenance and reduced thermal non-uniformity and particle contamination.
Implementation Method 1
The RF strap may include a flexible coupling configured to accommodate thermal expansion of the RF rod
Implementation Method 2
a heater rod disposed within the first end of the connector
Implementation Method 3
an RF rod. The second stem section may include an RF extension rod extending through the rod holder
Data Source
AI summary
Exemplary substrate support assemblies may include a platen characterized by a first surface configured to support a semiconductor substrate. The assemblies may include a first stem section coupled with a second surface of the platen opposite the first surface of the platen. The assemblies may include a second stem section coupled with the first stem section. The second stem section may include a housing and a rod holder disposed within the housing. The second stem section may include a connector seated within the rod holder at a first end of the connector. The second stem section may include a heater rod disposed within the first end of the connector and a heater extension rod coupled with the connector at a second end of the connector. The second stem section may include an RF rod and an RF strap coupling the RF rod with an RF extension rod.