Modular Test Assembly for Automated IC Validation
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Solution Overview
Problem
Current validation testing methods for devices like integrated circuits require manual intervention and redesign to accommodate various instruments and conditions, limiting efficiency and scalability.
Innovation Solution
A modular and scalable test assembly using multiple printed circuit board assemblies with configurable contacts and relays, allowing automatic connection and reconfiguration of instruments without human involvement, enabling testing across different supply voltages and loads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual intervention and redesign are used to accommodate various instruments and testing conditions, then testing flexibility is maintained, but testing efficiency and scalability are limited
Solution Approach 1:
The test assembly is divided into multiple modular circuit boards, each capable of being independently configured with specific instruments and testing conditions. This segmentation allows parallel testing operations and eliminates the need for manual redesign when accommodating different instruments, thereby improving testing efficiency while maintaining manageable complexity through standardized modules.
Solution Approach 2:
The circuit boards are designed with configurable contacts and relays that can be dynamically adjusted to accommodate various instruments and testing conditions. This dynamic reconfiguration capability eliminates the need for manual intervention and redesign, allowing the system to adapt to different testing requirements efficiently while maintaining a consistent physical architecture.
2Adaptability or versatility
If fixed test assembly design is used, then manufacturing simplicity is maintained, but adaptability to different instruments and conditions is reduced
Solution Approach 1:
Each circuit board is designed as a universal module with standardized headers, contacts, and relay configurations that can accommodate multiple different instruments and testing conditions. This multi-functionality allows the same basic assembly design to be used across various testing scenarios, improving adaptability without complicating the manufacturing process, as the modular design can be mass-produced and then configured for specific uses.
Solution Approach 2:
The circuit boards incorporate configurable parameters through adjustable contacts and relay settings that can be modified to match different instrument specifications and testing conditions. This parameter adjustability enables a single manufacturing design to serve multiple purposes, enhancing instrument compatibility while maintaining manufacturing simplicity through standardized production processes.
3Extent of automation
If modular circuit boards with configurable contacts are used, then automation capability is improved, but device complexity increases
Solution Approach 1:
The automatic connection capability is achieved through segmented modular circuit boards with standardized interfaces. Each module can be independently configured and connected, allowing automated systems to manage connections through simple plug-and-play operations rather than complex manual wiring, thereby improving automation while keeping individual module complexity manageable.
Solution Approach 2:
The circuit boards incorporate self-configuring features through standardized contacts and relay arrangements that automatically establish proper connections when modules are assembled. This self-service capability reduces the need for complex manual configuration and lowers the operational complexity, allowing automated systems to easily manage the test assembly without requiring sophisticated configuration procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables automated and flexible validation testing of integrated circuits with multiple instruments, improving efficiency and scalability by allowing easy addition of new instruments and configurations without redesign.
Implementation Method 1
A relay on the board permits the board's instrument to be activated
Implementation Method 2
a conductive member electrically connecting the first I/O terminal of one board to the second I/O terminal of another board
Data Source
AI summary
A test assembly includes multiple circuit boards. Each board includes multiple pairs of contacts configurable to address the respective circuit board, an instrument, first and second headers at opposing edges of the respective board. Each pin of a first header electrically connects through the board to a corresponding pin of a second header. Each board includes first and second input/output (I/O) terminals at opposing edges of the respective board, the first I/O terminal electrically connects through the board to the second I/O terminal. A relay on the board permits the board's instrument to be activated. Each of the circuit boards mechanically and electrically connects to another circuit board through a jumper cable connecting the first header of one circuit board to the second header of another circuit board and through a conductive member electrically connecting the first I/O terminal of one board to the second I/O terminal of another board.