Modular Test Carrier for Electronic Device Structural and Functional Testing
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Solution Overview
Problem
Current test systems lack the capability to efficiently perform comprehensive structural and functional testing of electronic devices, particularly in a modular and flexible manner that accommodates various types of devices and testing requirements.
Innovation Solution
A test system comprising a test carrier with integrated electronics for performing structural and functional tests, connected via an interface to a slot that enables communication with a system for component-level and system-level testing, utilizing robotics for movement and a computing system for controlling test flows, and accommodating multiple test carriers with different components for asynchronous testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If comprehensive structural and functional testing is performed on electronic devices, then testing thoroughness is improved, but device complexity and testing time increase
Solution Approach 1:
The testing system is divided into modular test carriers, each containing specific test components for structural or functional testing. This segmentation allows the complex testing process to be broken into manageable, independent modules that can be selectively activated based on testing requirements, reducing overall system complexity while maintaining comprehensive testing capability.
Solution Approach 2:
Test carriers are designed with universal interfaces and standardized components that can perform multiple testing functions. The same test carrier infrastructure supports both structural testing and functional testing, eliminating the need for separate dedicated systems and reducing complexity while achieving comprehensive testing coverage.
2Productivity
If multiple test carriers are accommodated for parallel testing, then productivity is improved, but device complexity and resource requirements increase
Solution Approach 1:
The system accommodates multiple independent test carriers in parallel, each self-contained with its own test components. This segmentation enables simultaneous testing of multiple devices without requiring complex interconnections between test units, simplifying system configuration while maximizing throughput.
Solution Approach 2:
Test carriers are designed with nested structures where test components are integrated within carrier housings that provide mechanical support and electrical connections. This nesting allows compact arrangement of multiple carriers in the testing system, increasing productivity without proportionally increasing space or configuration complexity.
3Adaptability or versatility
If different types of test components are used for different devices, then adaptability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Test carriers incorporate universal interfaces and standardized connection mechanisms that can accommodate different device types. The same carrier design can be used across multiple device platforms, reducing manufacturing complexity while maintaining adaptability to test various devices with appropriate test component selection.
Solution Approach 2:
While maintaining universal carrier structures, the system allows customization of specific test components for different device types. This local quality approach enables adaptation to specific device requirements without redesigning the entire carrier system, balancing manufacturing ease with testing flexibility.
Data Source
AI summary
An example test system includes a test carrier to receive a device to test. The test carrier includes test components to perform at least a structural test on the device. The example test system also includes a slot to receive the test carrier. The slot includes an interface to which the test carrier connects to enable the test carrier to communicate with a system that is part of the test system or external to the test system.