Thermal control system for an automated test system
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Solution Overview
Problem
System-level testing (SLT) systems face challenges in accommodating diverse device types with different form factors, electrical interfaces, thermal requirements, and physical interfaces, limiting their ability to efficiently test a wide range of devices simultaneously.
Innovation Solution
A modular test system with configurable packs and pick-and-place automation that supports various device types, featuring adjustable test sockets, thermal control systems, and ionized air supply, enabling simultaneous testing of devices with different characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed configuration test system is used, then the testing process is simple and reliable, but the system cannot accommodate diverse device types with different form factors and interfaces
Solution Approach 1:
The test system is divided into modular packs, each containing test sockets and electronics configured for specific device types. These packs can be independently swapped to accommodate different device form factors and testing requirements, enabling versatility without requiring the entire system to be reconfigured.
Solution Approach 2:
The test system incorporates dynamically reconfigurable elements including adjustable test socket positions, movable lids with actuators, and replaceable packs. These dynamic components allow the system to adapt its configuration based on the specific device being tested, transitioning from a static to a flexible architecture.
2Productivity
If multiple device types are tested simultaneously, then testing throughput increases, but thermal interference between devices affects testing accuracy
Solution Approach 1:
The test system separates devices into different packs or rows that can be thermally isolated from each other. Each pack can have independent thermal control, allowing simultaneous testing of multiple device types while preventing thermal interference between them through physical and thermal segmentation.
Solution Approach 2:
The system implements localized thermal control for each test socket or pack, allowing independent temperature management for each device being tested. This enables different thermal conditions to be maintained for different devices simultaneously, ensuring accurate testing despite high throughput operations.
3Adaptability or versatility
If test sockets are fixed in position, then the system structure is simple and stable, but the system cannot accommodate devices with different pitches and form factors
Solution Approach 1:
The test sockets are mounted on movable structures that allow adjustment of their positions and pitches. Actuators and mechanical adjustment mechanisms enable the sockets to be repositioned to accommodate different device form factors and pin pitches, transforming a static socket array into a dynamically adjustable configuration.
Solution Approach 2:
The test system employs universal test socket designs that can accommodate multiple device types through adjustment mechanisms. The same physical socket structure can be reconfigured to test different device pitches and form factors, eliminating the need for dedicated sockets for each device type.
4Manufacturing precision
If lids are manually placed on test sockets, then the alignment process is simple, but alignment precision is insufficient for accurate testing
Solution Approach 1:
The system replaces manual mechanical lid placement with automated actuator systems that use controlled mechanical motion to position lids with high precision. These actuators provide repeatable, precise alignment that exceeds manual capability while maintaining mechanical simplicity through standardized actuation mechanisms.
Solution Approach 2:
The lid assembly incorporates self-aligning features such as tapered guides, alignment pins, or compliant mounting structures that automatically position the lid correctly as it is installed. This self-alignment mechanism reduces the precision requirements of the actuator while ensuring accurate final positioning without complex alignment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for efficient and flexible testing of diverse devices, ensuring proper alignment, temperature control, and electrostatic protection, thereby enhancing testing throughput and accuracy.
Implementation Method 1
The thermal control system includes a thermoelectric cooler in thermal communication with the DUT and a heater in thermal communication with the structure
Implementation Method 2
The structure is thermally conductive and configured to transfer heat between the DUT and the liquid coolant
Implementation Method 3
The test system may include an ionized air supply and one or more fans to move ionized air from the ionized air supply over at least some of the test sockets
Data Source
AI summary
An example test system includes test sites for testing devices under test (DUTs), where the test sites include a test site configured to hold a DUT for testing. The test system includes a thermal control system to control a temperature of the DUT separately from control over temperatures of other DUTs in other test sites. The thermal control system includes a thermoelectric cooler (TEC) and a structure that is thermally conductive. The TEC is in thermal communication with the DUT to control the temperature of the DUT by transferring heat between the DUT and the structure.