Modular Thermal Bus Cooling for High-Density PC Heat Sources
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Solution Overview
Problem
Conventional cooling methods, such as heat pipes and fan-mounted heat sinks, are inadequate for managing the increasing heat dissipation requirements of high-performance integrated circuits in personal computers, particularly in densely configured systems where space for air cooling is limited.
Innovation Solution
A modular and scalable liquid-based cooling system utilizing two fluid loops: a collection loop for heat transfer from heat generating devices to a thermal bus and a rejection loop for heat dissipation to the ambient through a fluid-to-air heat exchanging system, with optional TEC-based radiators for enhanced thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional air cooling methods (heat pipes and fan-mounted heat sinks) are used, then the cooling system is simple to implement, but they are inadequate for managing high heat dissipation requirements of high-performance integrated circuits
Solution Approach 1:
The patent applies hydraulic cooling by using liquid coolant flowing through tubing to transfer heat from integrated circuits. The coolant circulates through heat exchangers that make thermal contact with heat-generating components, efficiently removing heat that air cooling cannot handle. This hydraulic approach provides superior cooling effectiveness while managing the complexity through systematic fluid circulation design.
Solution Approach 2:
The cooling system is segmented into multiple independent loops, each dedicated to cooling specific heat-generating components. This segmentation allows each loop to be optimized for its particular thermal load while maintaining overall system reliability. If one loop fails, others continue to function, and the modular structure manages complexity by breaking down the overall cooling system into manageable independent units.
2Productivity
If more numerous and powerful integrated circuits are added to the same personal computer chassis, then processor performance per unit volume increases, but thermal density increases beyond the capability of conventional air-cooling methods
Solution Approach 1:
The patent uses liquid coolant circulation to manage high thermal density from multiple powerful integrated circuits packed in a compact chassis. The hydraulic system transfers heat efficiently from densely packed components through tubing and heat exchangers, handling thermal loads that exceed air cooling capabilities while maintaining high processor density and performance per unit volume.
Solution Approach 2:
The patent introduces liquid coolant as an intermediary substance to transfer heat from integrated circuits to heat exchangers. This intermediary fluid medium enables efficient heat removal from densely packed high-performance components, bridging the gap between heat generation at the component level and heat rejection to the environment, thereby managing thermal density while maintaining high productivity.
3Ease of manufacture
If conventional cooling equipment (heat sinks and fans) is used, then the cooling system is easy to manufacture, but the amount of air available for cooling and the space available for cooling equipment is limited in compact chassis
Solution Approach 1:
The patent replaces bulky air cooling equipment with compact hydraulic cooling components. Liquid coolant tubing and heat exchangers occupy significantly less space than traditional heat sinks and fans, enabling effective cooling in compact personal computer chassis while maintaining ease of manufacture through standardized hydraulic components and routing.
Solution Approach 2:
The patent transitions from three-dimensional air cooling structures (large heat sinks requiring vertical and horizontal space) to two-dimensional tubing routing that can be laid flat against component surfaces. This dimensional change allows cooling infrastructure to be integrated into compact chassis designs without consuming excessive volume, maintaining manufacturability while reducing space requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages high thermal densities by providing a flexible and efficient cooling mechanism that can be expanded and adapted to accommodate varying heat loads, improving thermal performance and accommodating multiple heat generating devices within a personal computer chassis.
Implementation Method 1
Heat is transferred from the one or more heat generating device to fluid passing through the collection loop via the one or more heat exchanging devices. The fluid is continually pumped through a series of flexible and inflexible tubing to a transfer cold plate.
Implementation Method 2
Heat is transferred from the fluid in the collection loop to a thermal bus of the rejection loop via thermal interface, thereby removing the heat from the collection loop.
Implementation Method 3
Heat is transferred from the fluid in the collection loop to a thermal bus of the rejection loop via thermal interface, thereby removing the heat from the collection loop. Within the rejection loop, a fluid is continuously pumped from the thermal bus to a fluid-to-air heat exchanging system
Implementation Method 4
The fluid is continually pumped through a series of flexible and inflexible tubing to a transfer cold plate. Within the rejection loop, a fluid is continuously pumped from the thermal bus to a fluid-to-air heat exchanging system
Data Source
AI summary
A cooling system is used to cool heat generating devices within a personal computer. The cooling system has a first fluid loop and an expandable array of one or more second fluid loops. For each of the second fluid loops, heat generating devices transfer heat to fluid flowing through corresponding heat exchanging devices in the loop. Heat is transferred from the fluid in each second fluid loop to a thermal bus of the first fluid loop via a thermal interface. The second fluid loop can be a pumped fluid loop or can include a heat pipe. Within the first fluid loop, a fluid is continuously pumped from the thermal bus to a fluid-to-air heat exchanging system and back to the thermal bus. Heat transferred to the thermal bus from the first fluid loop is transferred to the fluid in the second fluid loop passing through the thermal bus. The heated fluid is pumped through the fluid-to-air heat exchanging system where the heat is transferred from the fluid to the ambient. The thermal bus provides a modular, scalable cooling system which allows for the expansion of cooling capacity without breaking the fluid lines.