Modular Thermal Bus for Repairable MRI Superconducting Coils
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Solution Overview
Problem
Conduction-cooled superconducting magnets in magnetic resonance devices face challenges in achieving effective thermal connection with cryocoolers, and existing solutions either complicate manufacturing or provide inefficient cooling, making repairs and replacements difficult, especially in high-field devices.
Innovation Solution
A magnet arrangement with a modular thermal bus comprising embedded elements and linking elements, allowing for a thermal and mechanical connection between superconducting coils and a cooling system, enabling efficient heat transfer while facilitating disassembly for repairs or replacements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid helium pipes are attached to the superconducting magnet to cool it down, then cooling effectiveness is improved, but manufacturing complexity and risk of leakage increase
Solution Approach 1:
The thermal bus is divided into multiple segments that can be separately manufactured and then assembled to the superconducting magnet. Each segment can be independently produced with standard manufacturing processes, avoiding the need for complex custom pipe fabrication while maintaining effective cooling coverage.
Solution Approach 2:
The patent introduces a thermal bus as an intermediary component between the superconducting magnet and the cooling system. This thermal bus acts as a mediator that distributes coolant flow and heat transfer, replacing the need for complex direct pipe attachments to the magnet itself.
2Temperature
If a thermal bus is bonded to the outer surface of the superconducting magnet, then thermal contact is improved, but repairability and replaceability worsen
Solution Approach 1:
The thermal bus is designed as a segmented structure with modular components that can be independently removed and replaced. The segmentation allows specific damaged sections to be replaced without requiring removal of the entire thermal bus or damage to the superconducting magnet, thereby maintaining good thermal contact while enabling easy repair.
Solution Approach 2:
The thermal bus incorporates dynamic or adjustable mounting mechanisms that allow for assembly and disassembly while maintaining thermal contact. This enables the thermal bus to be removed for repairs and reinstalled, transforming a previously static bonded connection into a dynamically reversible one.
3Stability of the object's composition
If a thermal bus is bonded to the superconducting magnet to secure it, then mechanical stability is improved, but adaptability for repairs worsens
Solution Approach 1:
The thermal bus is divided into modular segments that can be independently secured to the superconducting magnet. Each segment can be attached with stable mechanical connections that can also be detached for repairs, providing both stability during operation and adaptability for maintenance.
Solution Approach 2:
The thermal bus design incorporates universal mounting features that serve multiple functions: providing mechanical stability during operation, enabling easy disassembly for repairs, and allowing reconfiguration if needed. This multi-functionality resolves the contradiction between stability and repairability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular thermal bus enhances cooling efficiency and allows for the disassembly of superconducting coils, addressing the inefficiencies of previous methods and simplifying maintenance in high-field magnetic resonance devices.
Implementation Method 1
bonding a highly thermal conductive material to an outer surface of the superconducting magnet to form a thermal bus that transports heat energy to the cryocooler
Data Source
AI summary
A magnet arrangement for a magnetic resonance device is provided, comprising a first magnet coil, a second magnet coil, and a modular thermal bus. The first magnet coil and the second magnet coil each comprise a superconducting wire arranged in a matrix structure, and the modular thermal bus comprises an embedded element and a linking element. The embedded element is embedded within the matrix structure of the first magnet coil, and the embedded element and the second magnet coil are thermally and mechanically connected via the linking element. A magnetic resonance device is also provided for acquiring magnetic resonance data of an object positioned within an imaging region of the magnetic resonance device, comprising the magnet arrangement.