Modular Thermal Control for High-Powered Integrated Circuitry
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Solution Overview
Problem
Existing thermal solutions for high-powered semiconductor packages have fixed designs that cannot be scaled or modified after deployment, leading to inadequate heat dissipation and temperature control.
Innovation Solution
The development of modular thermal management systems that allow for reversible and scalable thermal performance by adding or removing liquid-cooled attachment members, enabling adjustment of cooling capacity based on changing power dissipation requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed thermal solution is used for semiconductor packages, then the thermal design is simple and cost-effective, but the thermal performance cannot be scaled or modified after deployment
Solution Approach 1:
The thermal solution is divided into modular components (thermal attachment members) that can be independently added or removed from the semiconductor package. Each attachment member provides a discrete thermal pathway, allowing the system to be segmented into configurable thermal zones that can be tailored to specific power dissipation requirements without redesigning the entire thermal system.
Solution Approach 2:
The thermal solution transitions from a static, fixed configuration to a dynamic, reconfigurable system. Attachment members can be added or removed based on changing power dissipation requirements, enabling the thermal performance to adapt dynamically to different operational conditions and power levels throughout the product lifecycle.
2Temperature
If thermal attachment members are added to increase cooling capacity, then heat dissipation improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The thermal cooling capacity is segmented into discrete attachment members that can be individually manufactured and then configured in different quantities based on power requirements. This allows standardization of individual components while providing flexibility in system-level configuration, simplifying both manufacturing and assembly processes.
Solution Approach 2:
The thermal performance is adjusted by changing the quantity of attachment members rather than modifying the design parameters of each individual component. This allows thermal capacity to be scaled by simple addition or removal of identical standardized parts, avoiding complex redesign and manufacturing processes while achieving different heat dissipation levels.
3Adaptability or versatility
If a fixed thermal design is used, then manufacturing and deployment are straightforward, but the thermal solution cannot accommodate changing power dissipation requirements
Solution Approach 1:
The thermal system becomes dynamic and reconfigurable, allowing attachment members to be added or removed to match changing power dissipation requirements throughout the product lifecycle. This ensures that temperature control reliability is maintained under varying operational conditions by adapting the thermal capacity to the actual power load.
Solution Approach 2:
The attachment members serve multiple functions: they provide thermal pathways for heat dissipation, act as mechanical mounting structures, and enable system reconfiguration. This multi-functionality allows a single component design to address multiple requirements, improving adaptability without proportionally increasing complexity.
4Ease of operation
If modular attachment members are used for thermal control, then thermal performance can be customized and scaled, but device complexity and initial manufacturing cost increase
Solution Approach 1:
The thermal control system is segmented into standardized attachment members that can be independently configured. This segmentation enables simple addition or removal of components to achieve different thermal configurations, making the system easy to operate and customize while keeping individual component complexity low through standardization.
Solution Approach 2:
The modular attachment members are designed to be self-contained units with integrated thermal pathways and mounting features, allowing them to be easily added or removed without requiring complex system-level modifications or specialized assembly procedures. This self-service design simplifies both operation and maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides customizable, agile, and cost-effective thermal solutions that maintain optimal temperature control across varying power dissipation levels, reducing energy consumption and operational costs.
Implementation Method 1
liquid-cooled attachment members, enabling adjustment of cooling capacity
Implementation Method 2
liquid-cooled attachment members configured to receive a respective second amount of heat from the pedestal member
Data Source
AI summary
Modular assemblies for thermal management are provided. Modularity permits or facilitates scalable thermal performance with respect to power dissipation demands. Modularity also permits retrofitting a deployed cooling system based at least on a current power dissipation requirement. In some embodiments, a modular assembly can be reversibly reconfigured in order to adjust cooling capacity and fulfill a defined power dissipation target. In some embodiments, a modular assembly can include a liquid-cooled pedestal and multiple liquid-cooled attachment members that can be reversibly coupled to or reversibly decoupled from the liquid-cooled pedestal based at least on a power dissipation condition and/or a change thereof of a dissipative electronic component. The reversible coupling and reversible decoupling of the attachment members can permit or otherwise facilitate reversibly adjusting the heat transfer between the modular assembly and the dissipative electronic component. Scalability of thermal performance of the modular assembly can be achieved, at least in part, by the addition of liquid-cooled attachment members.