Modular Tire Electronics Assembly With Interchangeable Stacked Modules
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Solution Overview
Problem
Existing tire condition sensing devices lack a modular and interchangeable system for efficient installation and electrical connectivity, limiting their versatility and ease of use.
Innovation Solution
A modular electronics assembly for tires comprising a base and modules with interchangeable mechanical and electrical attachment elements, allowing for stacked installation and connectivity, which includes air pressure and temperature sensors, radio frequency transmitters, and identification signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a modular stacked arrangement with interchangeable modules is implemented, then the versatility and ease of installation are improved, but the device complexity increases
Solution Approach 1:
The tire monitoring system is divided into separate functional modules (pressure sensor module, temperature sensor module, transmitter module, etc.), each capable of independent installation and removal. This segmentation enables the system to achieve versatility through modular combinations while managing complexity by standardizing interfaces between modules and the base structure.
Solution Approach 2:
The patent implements universal mechanical attachment elements and electrical contacts that work across all module types. Each module uses the same attachment mechanism to connect to the base and to other modules, creating a multi-functional interface that simplifies the overall system despite the diversity of sensor functions available.
2Adaptability or versatility
If multiple sensor modules are stacked and mechanically attached, then the functionality and measurement capabilities are improved, but the installation complexity increases
Solution Approach 1:
The mechanical attachment elements and electrical contacts are pre-configured on each module during manufacturing, ensuring proper alignment and connectivity. This preliminary preparation eliminates the need for complex field assembly procedures, as modules can be directly stacked and connected without additional adjustment or wiring work.
Solution Approach 2:
The base structure serves as an intermediary platform that provides standardized mechanical support and electrical connectivity for all modules. This intermediary base simplifies installation by absorbing the complexity of mounting to the tire, allowing modules to be simply attached to the base rather than requiring direct installation to the tire structure.
3Ease of repair
If interchangeable modules with standardized attachment elements are used, then the ease of repair and replacement are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs standardized mechanical attachment elements with defined geometric parameters and tolerances that balance interchangeability requirements with manufacturing feasibility. By establishing specific parameter ranges for attachment element dimensions and tolerances, the system achieves easy module replacement while maintaining realistic manufacturing precision requirements.
Data Source
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AI summary
An electronics assembly includes a base and a plurality of modules. The base is configured for mechanical attachment to a tire. The base includes an electronic device, and also includes a mechanical attachment element. Each module includes an electronic device, a lower mechanical attachment element, and an upper mechanical attachment element. The lower mechanical attachment element on each one of the modules is configured for attachment to the upper mechanical attachment element on any other one of the modules. In this configuration, the modules are interchangeably mechanically attachable to each other in a stacked arrangement. Each lower mechanical attachment element is also configured for attachment to the mechanical attachment element on the base. The modules are thus mechanically attachable to the base interchangeably with each other, which enables any one of the modules to be installed as the lowermost module in the stacked arrangement.