Modular Assembly Transfer with Multi-Gripper for Cleanroom Continuity
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Solution Overview
Problem
Existing systems for joining electronic assemblies and manufacturing workpieces are not fully automated, leading to manual interventions that can cause errors and disrupt the formation of clean rooms, particularly ISO 5 clean rooms, which are essential for semiconductor manufacturing.
Innovation Solution
A system comprising multiple modules for loading, production, and unloading stations, with a multiple gripper for simultaneous handling of electronic assemblies and workpieces, allowing automated movement through a continuous process without manual intervention, creating a clean room environment suitable for microelectronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual intervention is used for transferring workpieces and covering with process covers, then the system is easier to operate and set up, but the formation of clean room environment cannot be ensured and errors may occur
Solution Approach 1:
The system is divided into multiple sealed modules (loading module, processing module, unloading module) that can be independently maintained. This segmentation allows each module to be kept at appropriate pressure differentials and cleanliness levels, with automated transfer mechanisms that maintain seal integrity during workpiece movement between modules.
Solution Approach 2:
Manual mechanical operations are replaced with automated robotic systems including robotic arms for workpiece handling, automated cover application mechanisms, and sealed transfer chambers. These automated systems operate within controlled environments, eliminating the need for personnel to enter clean room areas and thus preventing particle contamination.
2Device complexity
If manual steps are interrupted between individual positions, then the system is simpler to design, but continuous clean room formation is disrupted
Solution Approach 1:
The system employs continuous automated processes where workpieces are transferred through sealed modules without breaking the clean room environment. Automated conveyors and robotic transfer mechanisms maintain continuous operation, eliminating interruptions that would require clean room conditions to be broken and re-established.
Solution Approach 2:
Multiple processing functions are nested within sealed modular chambers that maintain clean room conditions. Each module contains its own controlled environment, and automated transfer mechanisms move workpieces between nested modules without exposing them to external contamination, maintaining continuous clean room formation throughout the entire process.
3Productivity
If fully automated system with multiple modules is implemented, then clean room formation is ensured and productivity increases, but device complexity increases
Solution Approach 1:
The automated modules are designed with universal interfaces and standardized configurations that can handle multiple workpiece types and processing operations. This multi-functionality reduces the number of specialized components needed, simplifying the overall system architecture while maintaining high productivity through automated continuous operation.
4Manufacturing precision
If multiple gripper with alignment function is used, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The multiple gripper system incorporates self-aligning features where the gripper fingers or clamps automatically adjust to workpiece dimensions and positions. Sensors and feedback mechanisms enable the gripper to self-correct alignment deviations, achieving precise workpiece positioning without requiring complex external alignment apparatus or manual intervention.
Data Source
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AI summary
The invention relates to a system (10) for connecting electronic assemblies (12) and/or for producing workpieces (14), comprising a plurality of modules (16) for connecting the electronic assemblies (12) and/or for producing the workpieces (14). The invention is characterised in that at least one module (16) is formed as a loading station (18) and one module (16) as an unloading station (20), or one module is formed as a loading station (18) and as an unloading station (20), at least one further module (16) being formed as a production station (21), and a production workpiece support (22) being provided for receiving the electronic assemblies (12) and/or the workpieces (14) and being movable in automated fashion by means of a transport unit (24) from the loading station (18) via the production station (21) to the unloading station (20), a multi-gripper (80) being provided, by means of which at least two electronic assemblies (12) and/or workpieces (14) can be placed simultaneously on the production workpiece support (22). The invention also relates to a film transfer unit (32) and a film remover unit (84) for a system (10) according to the invention and to a production workpiece support (22) with at least two workpieces (14), for use in a system according to the invention, and to a method (100) for connecting electronic assemblies (12) and/or for producing workpieces (14).