Modular Transformer-Rectifier Blocks With Vertical Substrate Integration

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional power converters face challenges in minimizing their physical footprint while maintaining high efficiency and thermal performance, particularly in applications with space constraints such as mobile devices and automotive systems.

Innovation Solution

A transformer-rectifier block design comprising a substrate with a transformer and rectifier circuit, where the transformer has primary and secondary windings wound in specific configurations, and the rectifier is mounted on the substrate, allowing for a compact and efficient power conversion module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If conventional power converter designs are used, then performance and reliability are maintained, but physical footprint is large

Engineering Contradiction:
Improvephysical footprintVSAvoidperformance and reliability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The transformer and rectifier circuit are merged into a single integrated module, with the rectifier circuit mounted directly on the same substrate as the transformer. This integration reduces the overall physical footprint by eliminating separate mounting spaces and interconnections, while maintaining performance through optimized electrical connections and reduced parasitic effects.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The design transitions from a planar layout to a three-dimensional stacked configuration, with the transformer on one side of the substrate and the rectifier circuit on the opposite side. This vertical arrangement significantly reduces the horizontal footprint while preserving all necessary electrical connections and thermal pathways.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If compact designs are implemented, then physical footprint is reduced, but thermal management becomes difficult

Engineering Contradiction:
Improvephysical footprintVSAvoidthermal performance
Core Design Contradiction:
Area of stationary objectVSTemperature

Solution Approach 1:

By stacking the transformer and rectifier circuit on opposite sides of the substrate vertically, the design reduces horizontal space occupation while creating dedicated thermal pathways through the substrate. This three-dimensional arrangement allows for effective heat dissipation without increasing the horizontal footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design reduces the overall footprint of power converters without compromising performance or reliability, enabling scalable and efficient power conversion for various applications.

Implementation Method 1

The transformer comprises a magnetic core, a first primary winding, a first secondary winding that is wound over the first primary winding

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS20260066809A1Modular transformer-rectifier blocks for power converters
Publication Date: 2026.03.05 MONOLITHIC POWER SYSTEMS INC
  • US20260066809A1 patent drawing
  • US20260066809A1 patent drawing
  • US20260066809A1 patent drawing

AI summary

Disclosed are transformer-rectifier blocks for power converters. A transformer-rectifier block has a transformer and a rectifier circuit that are vertically integrated with a substrate. The transformer has a magnetic core, primary windings that have one or more turns, and secondary windings that are wound a single turn over corresponding primary windings. The transformer is mounted on one side of the substrate, and the rectifier circuit is mounted on an opposing side of the substrate.