Modular Ultrasonic Wall Thickness Transducer for High Temperatures
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Solution Overview
Problem
Existing ultrasonic transducers have temperature limits below 150°C, preventing their use in high-temperature applications, and lack features for in-situ temperature measurement and health information processing, complicating assembly and failing to meet Industry 4.0 and NDE 4.0 requirements.
Innovation Solution
A modular ultrasonic transducer design with a piezoelectric element that operates above 150°C, integrated with a temperature sensor and a compact, adhesive-free assembly, allowing for in-situ temperature measurement and easy replacement of components, and supporting multiple temperature ranges without redesign.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If epoxies and adhesives are used in ultrasonic transducers, then the transducer can be assembled, but the temperature limit is restricted to below 150°C
Solution Approach 1:
The patent removes epoxies and adhesives from the transducer assembly, extracting the problematic bonding agents that limited temperature operation. The transducer is assembled without these temperature-restricting materials, enabling high-temperature operation above 150°C while maintaining assembly feasibility through alternative mechanical coupling methods.
Solution Approach 2:
The patent changes the material parameters by selecting components and interfaces that can withstand high temperatures without requiring epoxies or adhesives. This parameter change in material selection and assembly methodology enables operation at temperatures exceeding 150°C while maintaining structural integrity.
2Adaptability or versatility
If in-situ temperature measurement and health information processing features are added, then Industry 4.0 requirements are met, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the transducer assembly by integrating in-situ temperature measurement capabilities and health information processing features directly into the transducer structure. This merging of functions enables Industry 4.0 compatibility while managing complexity through integrated design rather than separate components.
Solution Approach 2:
The transducer is designed with multi-functionality to perform not only ultrasonic thickness measurement but also in-situ temperature measurement and health information processing. This universal design allows a single device to meet Industry 4.0 requirements across multiple operational parameters without requiring separate dedicated devices.
3Adaptability or versatility
If modular design with replaceable piezoelectric elements is implemented, then adaptability to different temperature ranges is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the transducer into modular components with replaceable piezoelectric elements that can be selected for different temperature ranges. This segmentation allows adaptation to various temperature applications by simply replacing the piezoelectric element while keeping the rest of the assembly unchanged, managing manufacturing complexity through standardization of the modular interface.
Solution Approach 2:
The transducer design incorporates dynamic adaptability through replaceable piezoelectric elements, allowing the system to be reconfigured for different temperature ranges as needed. This dynamic capability enables the same basic assembly to serve multiple temperature applications by swapping components rather than manufacturing entirely different devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate thickness measurement in high-temperature environments, simplifies assembly, and supports Industry 4.0 requirements by providing in-situ temperature measurement and health information processing, facilitating easy maintenance and calibration.
Implementation Method 1
a piezoelectric element (106) configured to generate an ultrasonic vibration in response to an applied voltage
Implementation Method 2
generate an ultrasonic vibration in response to an applied voltage, the ultrasonic vibration being configured to travel through a structural asset
Implementation Method 3
integrated with a temperature sensor and a compact, adhesive-free assembly, allowing for in-situ temperature measurement
Data Source
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AI summary
An ultrasonic transducer for high temperature application forms part of ultrasonic wall thickness measurement system. The ultrasonic transducer has a modular design. The ultrasonic transducer has a modular design which enables the selection of piezoelectric element type based on field applications without changing the manufacturing process and redesigning of other components. A temperature sensor can be provided as part of the ultrasonic transducer. Methods of assembly are also provided.