Modular Vacuum Collet Structure for Collision-Free Chip Pickup
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor chip pick-up collets face challenges with interference between chips and complex structures, requiring a simple and efficient design to prevent collisions and improve productivity.
Innovation Solution
A collet structure comprising a holder with a shank and vacuum provider, a plate with vacuum holes, and an absorption member, which includes magnets for alignment and vacuum distribution to securely pick up semiconductor chips without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a collet with complex structure is used to pick up semiconductor chips, then the pick-up reliability may be improved, but the device complexity increases and periodic part exchange is required
Solution Approach 1:
The collet is divided into three separable components: a holder, a plate, and an absorption member. This segmentation allows each component to be independently manufactured and maintained, reducing overall system complexity while maintaining pick-up reliability through modular assembly.
Solution Approach 2:
The absorption member is designed to be replaceable and can be easily exchanged by operators without requiring complex disassembly procedures. This self-service design enables periodic maintenance to be performed quickly and simply, addressing the reliability requirement without increasing operational complexity.
2Reliability
If a collet with complex structure is used to prevent interference between chips, then collision prevention may be improved, but the ease of operation deteriorates due to difficult disassembly
Solution Approach 1:
By separating the collet into holder, plate, and absorption member components, the design simplifies disassembly and reassembly operations. The segmented structure maintains collision prevention capabilities through proper component geometry while enabling easy maintenance and operation.
Solution Approach 2:
The collet components are designed with dynamic characteristics that allow easy assembly and disassembly during operation. The absorption member can be quickly removed and replaced, and the plate can be detached from the holder, enabling operational flexibility without compromising collision prevention during the pick-up process.
3Ease of manufacture
If a collet with simple structure is used to improve ease of manufacture, then manufacturing complexity is reduced, but the productivity may deteriorate due to one-by-one chip pickup
Solution Approach 1:
The segmented collet structure with holder, plate, and absorption member components is designed to be manufacturable using standard processes. The modular design maintains ease of manufacture while enabling efficient chip handling operations.
Solution Approach 2:
The absorption member utilizes vacuum suction through multiple vacuum holes to pick up chips. This pneumatic mechanism enables simultaneous or sequential pick-up of multiple chips in an efficient manner, improving productivity without requiring complex mechanical structures. The vacuum-based approach allows for rapid chip acquisition and transfer operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the efficiency of semiconductor chip pick-up, reduces process errors, and allows for easy disassembly, improving productivity and compatibility with various chip sizes.
Implementation Method 1
The second magnet may be magnetically combined with the first magnet
Implementation Method 2
The vacuum provider may include at least one first vacuum hole configured to transfer vacuum, which may be supplied from the outside, to a space under the shank
Data Source
AI summary
A collet structure may include a holder, a plate and an absorption member. The holder may include a shank and a vacuum provider. The shank may include a first magnet. The vacuum provider may be positioned over the shank. The vacuum provider may include at least one first vacuum hole configured to transfer vacuum, which may be supplied from the outside, to a space under the shank. The plate may have a size substantially the same as a size of the shank. The plate may include a plurality of second vacuum holes connected directly and indirectly to the first vacuum hole. The absorption member may be attached to the plate. The absorption member may include a plurality of third vacuum holes connected directly and indirectly to the plurality of second vacuum holes.