Modular Vehicle Compute Unit With PCB Cooling and EMI Shielding
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Solution Overview
Problem
Existing vehicle central compute units face integration complexity due to non-standardized hardware and software configurations from different vendors, leading to inefficient system integration, functional losses, and vulnerability to environmental stresses like temperature and electromagnetic interference.
Innovation Solution
A modular construction for vehicle central compute units incorporating a printed circuit board with thermal distribution layers and coupling areas for efficient heat dissipation, embedded sensors for monitoring, and a housing design that provides electromagnetic shielding and mechanical stabilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple non-standardized hardware configurations from different vendors are integrated, then hardware versatility is improved, but system integration complexity increases
Solution Approach 1:
The patent applies universality by defining a standardized main frame structure with uniform mounting interfaces, cooling channels, and electrical connections that can accommodate different electronic modules from various vendors. The main frame serves as a universal platform that maintains compatibility across multiple hardware configurations while simplifying integration through consistent mechanical and electrical interfaces.
Solution Approach 2:
The patent segments the system into modular electronic modules that can be independently designed and manufactured by different vendors, then integrated into a standardized main frame. This segmentation allows hardware versatility through module variety while controlling integration complexity through the standardized main frame architecture that handles coordination centrally.
2Temperature
If thermal management is improved with thermal distribution layers, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the thermal distribution function with the structural housing by integrating cooling channels directly into the housing structure. This merging eliminates separate thermal management components, improves heat dissipation efficiency through direct thermal pathways, and simplifies manufacturing by combining structural and thermal functions into a single integrated component.
3Object-affected harmful factors
If electromagnetic shielding is added to protect against EMI, then protection against electromagnetic interference is improved, but device complexity increases
Solution Approach 1:
The patent applies universality by designing the main frame housing to serve multiple functions simultaneously: structural support, thermal management through integrated cooling channels, and electromagnetic shielding through conductive material layers. This multi-functionality provides comprehensive EMI protection while avoiding the complexity of separate shielding components by consolidating functions into the universal housing structure.
4Ease of repair
If modular construction is implemented, then ease of maintenance is improved, but hardware standardization decreases
Solution Approach 1:
The patent segments the electronic system into standardized modular modules with uniform interfaces that can be easily replaced and maintained. This segmentation improves maintenance ease through modular replaceability while the standardized interfaces actually increase hardware standardization rather than decreasing it, allowing modules from different vendors to interoperate through standardized connection protocols.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables scalable, efficient heat dissipation, electromagnetic interference protection, and robust mechanical stabilization, reducing integration complexity and enhancing functional safety and compatibility across different hardware configurations.
Implementation Method 1
a thermal distribution layer (7) integrated inside the printed circuit board (5)... configured for heat dissipation away from the printed circuit board (5)
Implementation Method 2
a housing (8) for the printed circuit board (5) with the electronic components (3)... configured to shield the printed circuit board (5) from electromagnetic radiation
Implementation Method 3
at least one spacer element (2) connected to the printed circuit board (5) on its outer side... configured to mechanically stabilize the printed circuit board (5)
Data Source
AI summary
A central compute unit, configured as a vehicle central compute unit, to a pocket module, to an electronic module, and to a printed circuit board, to a cooling blade, and to a main frame. The printed circuit board for an electronic vehicular component includes a thermal distribution layer in the printed circuit board and one or more thermal coupling areas on the surface of the printed circuit board. The one or more thermal coupling areas are configured for heat dissipation away from the printed circuit board, and the one or more thermal coupling areas are thermally coupled to the thermal distribution layer in the printed circuit board.