Modular Wafer Chuck With Interchangeable Sensor Modules
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Solution Overview
Problem
The manufacture of chucks adapted to different structures for testing wafers is cost-intensive and resource-intensive, hindering efficient and cost-effective functional testing of wafers with varying structures.
Innovation Solution
A modular wafer-chuck system with a chuck and a self-contained sensor module that can be coupled and decoupled, allowing the use of a standard chuck with interchangeable sensor modules tailored to specific wafers, enabling temperature control and measurement without direct electrical connections, and utilizing vacuum chambers and insulation layers for secure mounting and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different chucks are manufactured for each wafer structure, then temperature control precision is improved, but manufacturing cost and resource consumption increase
Solution Approach 1:
The system is divided into a reusable chuck body and interchangeable sensor modules. Each sensor module is designed for specific wafer structures, while the chuck body remains standardized. This segmentation allows the expensive customized parts (sensor modules) to be replaced without manufacturing new entire chucks, reducing overall manufacturing costs while maintaining temperature control precision.
Solution Approach 2:
The standardized chuck body with universal coupling surfaces can accommodate multiple types of sensor modules through the same interface. This multi-functionality allows a single chuck design to serve multiple wafer structure types by simply changing the sensor module, eliminating the need to manufacture dedicated chucks for each wafer type and significantly reducing manufacturing resources.
2Adaptability or versatility
If multiple chuck designs are created for different wafer structures, then adaptability is improved, but device complexity increases
Solution Approach 1:
The chuck system is segmented into a universal base unit and specialized sensor modules. The standardized coupling surface on the chuck body provides a common interface that can accept different sensor modules designed for specific wafer structures. This segmentation enables adaptability through module exchange rather than through multiple complex chuck designs.
Solution Approach 2:
The chuck body is designed with universal coupling surfaces that can interface with multiple types of sensor modules. This multi-functionality allows a single chuck design to adapt to different wafer structures by simply changing the attached sensor module, thereby achieving versatility without increasing the complexity of the chuck itself.
3Ease of manufacture
If standardized chucks are used for all wafer structures, then manufacturing cost is reduced, but temperature control precision deteriorates
Solution Approach 1:
While the chuck body remains standardized, the sensor modules incorporate structure-specific sensing and heating elements tailored to particular wafer types. This local quality ensures that temperature measurement and control are optimized for each wafer structure at the critical interface point, maintaining precision even though the overall chuck design is standardized.
Solution Approach 2:
The sensor module acts as an intermediary between the standardized chuck and the specific wafer structure. It provides the customized temperature sensing and control functionality needed for precise temperature management of different wafer types, while the standardized chuck provides the common mounting and thermal mass. This intermediary approach maintains precision without requiring customized chucks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective and flexible temperature control and measurement for various wafer structures by allowing the use of a standard chuck with customizable sensor modules, improving temperature monitoring and control efficiency during functional tests.
Implementation Method 1
using coupling surfaces for thermal energy transfer
Implementation Method 2
using coupling surfaces for thermal energy transfer and vacuum chambers for secure mounting
Data Source
AI summary
A modular wafer-chuck system is provided for mounting or clamping and temperature control of a wafer. The modular wafer-chuck system includes: a chuck for temperature control of a wafer; and a sensor module with at least one temperature-measuring apparatus for measuring a temperature of the sensor module and/or of the chuck and/or of a wafer mounted or clamped by the wafer-chuck system. The chuck has a coupling surface configured to detachably couple the sensor module, and the sensor module has a coupling surface configured to mount or clamp a wafer.