Modular Wafer Table Refurbishment for Stable Burl Coatings
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Solution Overview
Problem
Current processes for manufacturing wafer tables result in a high number of scrapped tables and limit the ability to apply high-temperature coatings due to material instabilities, increasing production costs and cycle times.
Innovation Solution
A modular approach is adopted where burls are removed from a scrapped wafer table, polished to form a core module, and bonded with separately manufactured burl modules, allowing for the application of high-temperature coatings and use of different materials for the burl modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional manufacturing processes are used for wafer tables, then material stability is maintained, but manufacturing costs and cycle times increase due to high scrappage rates
Solution Approach 1:
The wafer table is divided into separate modules: a core module (from scrapped table) and a burl module (separately manufactured). This segmentation allows each module to be optimized independently - the core module can be refurbished from scrap while the burl module uses stable, engineered materials, resolving the contradiction between cost reduction and material stability.
Solution Approach 2:
The wafer table combines different materials in a composite structure - the core module may use refurbished materials while the burl module uses engineered materials with stable properties. This composite approach enables cost reduction through scrap refurbishment while maintaining overall material stability through the stable burl module.
2Temperature
If high-temperature coatings are applied to traditional wafer tables, then coating performance is achieved, but material instabilities prevent successful application
Solution Approach 1:
By separating the wafer table into core and burl modules, the patent enables high-temperature coating to be applied only to the burl module which uses thermally stable engineered materials, while the core module from scrapped tables avoids high-temperature processing that would cause instability.
Solution Approach 2:
Different parts of the wafer table have different material properties - the burl module uses materials with high thermal stability suitable for high-temperature coatings, while the core module uses materials appropriate for its function. This local differentiation allows high-temperature coating application without compromising overall material stability.
3Manufacturing precision
If burls are removed and surface is polished to form core module, then manufacturing precision is improved, but additional processing steps increase cycle time
Solution Approach 1:
The core module is prepared in advance by removing burls and polishing the surface while the burl module is manufactured separately. These preliminary actions on the core module enable parallel processing of different modules, reducing overall cycle time while achieving the required surface finish precision.
Solution Approach 2:
By segmenting the wafer table into core and burl modules processed separately, the patent allows polishing and preparation of the core module to occur in parallel with burl module manufacturing, rather than sequentially. This reduces total cycle time while maintaining manufacturing precision on the core module surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and cycle times by enabling the use of robust burls with engineered properties and high-temperature coatings, improving wafer load grid and overlay issues.
Implementation Method 1
polishing the surface of the wafer table after removing the one or more burls using a chemical-mechanical polishing (CMP) process
Implementation Method 2
Bonding the core module to the burl module using such techniques as optical contacting/bonding, solder bonding, adhesive bonding, eutectic bonding, anodic bonding, metal-metal diffusion bonding
Implementation Method 3
Bonding the core module to the burl module using such techniques as optical contacting/bonding, solder bonding, adhesive bonding
Implementation Method 4
Bonding the core module to the burl module using such techniques as optical contacting/bonding, solder bonding, adhesive bonding
Implementation Method 5
Bonding the core module to the burl module using such techniques as optical contacting/bonding, solder bonding, adhesive bonding, eutectic bonding, anodic bonding, metal-metal diffusion bonding
Data Source
AI summary
The present disclosure is directed to a modular wafer table and methods for refurbishing a scrapped wafer to manufacture the modular wafer table. The method comprises removing one or more burls from a surface of a wafer table; polishing the surface of the wafer table after removing the one or more burls to form a core module; forming a burl module having a plurality of burls thereon; and bonding the core module to the burl module.