Modular Electrical Wiring Device Assembly Flush Fit

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Solution Overview

Problem

Conventional modular electrical wiring devices protrude from the wall due to their thickness, measured from the frame member to the aesthetic cover, which is a cosmetic and installation issue.

Innovation Solution

A modular electrical wiring device assembly with a frame assembly featuring a primary and secondary opening, eliminating the need for a separator or sub-plate, allowing the device to sit deeper within the frame and incorporating flexible tabs to prevent frame bending during installation, ensuring a flush fit with the wall surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If a conventional modular electrical wiring device assembly is used with a separator or sub-plate, then the device can be assembled and installed, but the assembly protrudes from the wall surface due to the thickness of the frame member, aesthetic cover, and separator components

Engineering Contradiction:
Improvethickness of assemblyVSAvoidinstallation complexity
Core Design Contradiction:
Length of stationary objectVSEase of operation

Solution Approach 1:

The patent removes the separator or sub-plate component from the conventional assembly, eliminating the need for this intermediate element that contributes to protrusion. The modular electrical wiring device is installed directly against the frame member, reducing the overall thickness while maintaining structural integrity through direct mounting.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent integrates the mounting function directly into the frame member structure, eliminating the need for a separate separator component. The frame member is designed to directly support the modular electrical wiring device, combining the structural support and mounting functions into a single integrated component.

Inventive Principle:
Principle #5Merging (Combining)

2Length of stationary object

If the frame member is made thinner to reduce protrusion, then the aesthetic appearance improves, but the frame may bend during installation due to reduced structural rigidity

Engineering Contradiction:
Improvethickness of assemblyVSAvoidframe rigidity
Core Design Contradiction:
Length of stationary objectVSStrength

Solution Approach 1:

The patent applies local reinforcement through ribs or strengthening features at critical locations on the frame member where bending stresses occur during installation. This allows the overall frame thickness to be reduced while maintaining sufficient rigidity at key structural points to prevent bending during mounting.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The frame member is designed with pre-formed ribs or strengthening features that provide structural support before installation occurs. This preliminary structural preparation ensures that the thin frame member maintains its rigidity and resists bending during the installation process, despite its reduced overall thickness.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11424603B2Modular electrical wiring device assemblies
Publication Date: 2022.08.23 PASS & SEYMOUR INC
  • US11424603B2 patent drawing
  • US11424603B2 patent drawing
  • US11424603B2 patent drawing

AI summary

A modular electrical wiring device assembly including, but not limited to, a frame assembly having a top surface, a bottom surface, a width, a length and a height; a primary opening defined by a primary opening surface, wherein the primary opening is positioned through the top surface and the bottom surface; a cover plate positioned over and in contacting relation to the top surface of the frame assembly, wherein the cover plate includes a cover plate opening positioned over and in line with the primary opening; and a modular electrical wiring device positioned through the cover plate opening and the primary opening, wherein a portion of the modular electrical wiring device is positioned below the bottom surface of the frame assembly.