Modular X-ray Detector With Integrated ASIC And Tungsten Collimator

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Solution Overview

Problem

Existing x-ray detectors face challenges in achieving high detection efficiency while enabling modular arrangement and efficient packaging and wiring, which often compromise geometrical efficiency, and require accurate alignment with anti-scatter grids to minimize dead areas and protect sensitive circuits from radiation.

Innovation Solution

A modular x-ray detector module design featuring Silicon detector substrates with integrated ASICs placed under Tungsten anti-scatter collimators, allowing for efficient power and data transfer without routing on the substrate, and using a tapered geometry with spacers to align components precisely with the x-ray source, along with a redistribution layer for signal routing and heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a modular arrangement of detectors is implemented, then ease of manufacture and adaptability are improved, but active detector area is reduced and geometrical efficiency is reduced

Engineering Contradiction:
Improvemodular arrangementVSAvoidactive detector area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The detector is divided into multiple independent detector modules that can be tiled together to form a larger detector array. Each module contains its own scintillator, photodiode, and integrated circuit, allowing flexible configuration while maximizing active area within each module by minimizing inter-module spacing.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If wiring and packaging are simplified for modular arrangement, then ease of manufacture is improved, but active detector area is reduced and geometrical efficiency is reduced

Engineering Contradiction:
Improvepackaging and wiringVSAvoidgeometrical efficiency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The integrated circuit is positioned directly adjacent to the photodiode on the same substrate, eliminating the need for separate wiring harnesses and complex packaging. This integration simplifies manufacturing while maintaining precise geometric alignment between the anti-scatter grid, scintillator, and detector elements.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If anti-scatter collimator or grid is integrated with detector, then scatter elimination is improved, but device complexity and dead area are increased

Engineering Contradiction:
Improvescatter eliminationVSAvoidintegration with anti-scatter grid
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The anti-scatter grid is positioned at an angle relative to the detector module, creating an asymmetric configuration that allows the grid to extend beyond the active detector area. This asymmetric placement enables effective scatter elimination while minimizing the dead area through optimized geometric relationships between the grid and detector elements.

Inventive Principle:
Principle #4Asymmetry

4Reliability

If integrated circuits are protected from direct radiation, then reliability is improved, but device complexity is increased

Engineering Contradiction:
Improveprotection from radiationVSAvoidcircuit protection
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The integrated circuit is positioned within the structural footprint of the anti-scatter grid, nesting the circuit under the grid's protective structure. This nested configuration provides radiation protection to the sensitive circuits through the grid's material shielding while maintaining a compact overall design without requiring additional protective components.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances detection efficiency, reduces dead areas, protects integrated circuits from radiation, and allows for precise alignment, enabling higher spatial and contrast resolution while maintaining modular flexibility and efficient production.

Implementation Method 1

State-of-the art detectors in for example Computed Tomography are based on a scintillator converting the x-rays to visible light that is detected by a dedicated photo diode

Methodology Applied
Scientific EffectScintillation: Scintillation

Implementation Method 2

a dedicated photo diode that integrate the signal for many x-rays

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Implementation Method 3

Silicon detectors need to be much longer (around 30-40 times) in the direction of the incoming x-rays in order to absorb a major fraction of the x-rays

Methodology Applied
Scientific EffectX-ray absorption: Absorption (EM radiation)

Data Source

PatentEP3353576B1Modular x-ray detector
Publication Date: 2020.07.01 PRISMATIC SENSORS
  • EP3353576B1 patent drawingFigure 1
  • EP3353576B1 patent drawingFigure 2
  • EP3353576B1 patent drawingFigure 3

AI summary

There is provided a detector module (1) for a modular x-ray detector, wherein the detector module (1) comprises multiple x-ray detector substrates (10) and associated anti-scatter collimators (20). Each x-ray detector substrate (10) has a number of detector diodes, and each x-ray detector substrate has an associated anti-scatter collimator (20). Each x-ray detector substrate (10) has an integrated circuit (30) for collecting x-ray signals from the diodes attached to the x-ray detector substrate at the bottom of the x-ray detector substrate assuming the top is where the x-rays enter, and the associated anti-scatter collimator (20) is placed above the integrated circuit (30).