Modular X-ray Detector Assembly with Through-Hole Interconnects
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Solution Overview
Problem
Current x-ray computed tomography (CT) imaging systems face challenges in designing modular detector measurement systems that can handle large numbers of channels, require efficient connection and protection of electronic components from x-ray damage, and manage heat generation while maintaining mechanical accuracy.
Innovation Solution
The solution involves an x-ray detector assembly with a plurality of scintillator elements and photodetectors on fused substrates, through-hole connections for signal coupling, and modular assembly methods that include x-ray shielding and thermal management to protect components and ensure accurate assembly in both the X- and Z-directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a large number of detector channels are integrated into a single system, then high-speed volume imaging capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The detector system is divided into multiple independent modules, each containing a subset of detector channels. This segmentation allows the system to achieve high channel counts for fast volume imaging while keeping individual modules manageable in complexity. Each module can be independently manufactured, tested, and assembled into the complete detector array.
2Productivity
If electronic components are placed near x-ray sources, then signal acquisition efficiency is improved, but reliability decreases due to x-ray damage
Solution Approach 1:
Electronic components are extracted from the direct x-ray path and placed in shielded locations. The patent implements physical separation between the x-ray detection area and the electronic processing area, with only necessary signal paths penetrating through controlled interfaces. This extraction protects electronic components from x-ray damage while maintaining signal acquisition efficiency through optimized signal routing.
Solution Approach 2:
Signal transmission interfaces and shielding structures serve as intermediaries between the x-ray detection region and electronic processing regions. These intermediaries allow efficient signal transfer while blocking harmful x-rays from reaching sensitive electronic components, resolving the contradiction between proximity for efficiency and separation for protection.
3Volume of moving object
If electronic components are integrated closely, then miniaturization is improved, but heat management becomes difficult
Solution Approach 1:
The patent implements localized thermal management solutions within each module, with heat sinks and cooling channels positioned specifically at high-heat-generation areas. Different regions of the module have different thermal management characteristics tailored to their specific heat generation patterns, allowing compact integration while effectively managing temperature distributions.
4Ease of manufacture
If modular assembly is implemented, then ease of manufacture is improved, but manufacturing precision requirements increase
Solution Approach 1:
Alignment features and mechanical interfaces are pre-configured during individual module manufacturing with high precision. Reference surfaces, positioning pins, and alignment marks are established in advance during module fabrication, so that when modules are assembled together, the preliminary alignment work has already been completed, reducing the precision requirements during final assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient signal acquisition, effective protection of electronic components from x-rays and heat, and precise assembly of super-modules, addressing the challenges of high-channel CT systems by providing reliable and scalable modular x-ray measurement systems.
Implementation Method 1
a plurality of x-ray scintillator elements arranged in an array
Implementation Method 2
An array of photodetectors, which have coplanar contacts, is disposed on the top surface of the first substrate
Data Source
AI summary
An x-ray detector assembly includes a first substrate and a second substrate. An array of photodetectors, which have coplanar contacts, are disposed on the top surface of the first substrate. The x-ray detector assembly further includes a plurality of x-ray scintillator elements arranged in an array. The photodetectors are aligned so as to match the array of x-ray scintillator elements. The second substrate is fused to the bottom surface of the first substrate. The second substrate provides on its distal side a planar connectivity pattern matched to electronics of a signal acquisition system. One or more through-hole connections traverse both substrates, and are configured to couple the contacts of the photodetectors from the top surface of the first substrate to the connectivity pattern on the distal side of the second substrate.