Compositionally Modulated TFT Active Region for Low Leakage
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Solution Overview
Problem
Existing thin film transistors (TFTs) made of oxide semiconductors face challenges in integration with previously fabricated devices due to high processing temperatures, which can damage front-end-of-line (FEOL) and middle end-of-line (MEOL) devices.
Innovation Solution
The formation of thin film transistors with a compositionally-modulated active region, including a continuous bottom gate dielectric layer and active layer, minimizes surface leakage and allows for direct contact between source and drain electrodes, using semiconducting metal oxides like indium gallium zinc oxide (IGZO) and a vertical compositional modulation to reduce leakage current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high processing temperatures are used to fabricate oxide semiconductor TFTs, then device performance is improved, but previously fabricated FEOL and MEOL devices are damaged
Solution Approach 1:
The patent changes the temperature parameter of the fabrication process from high temperature to low temperature (below 450°C, preferably below 400°C). This parameter change allows the TFT to be fabricated without damaging previously fabricated FEOL and MEOL devices, while still achieving acceptable device performance through optimized low-temperature processing techniques
Solution Approach 2:
The patent introduces a compositionally-modulated active region with different material compositions at different locations within the active layer. This local quality variation creates regions with different properties (e.g., higher mobility regions, lower resistance regions) that optimize device performance without requiring high processing temperatures
2Reliability
If a compositionally-modulated active region is used, then surface leakage is reduced, but manufacturing complexity increases
Solution Approach 1:
The active region is segmented into multiple layers or zones with different compositions (e.g., first active layer, second active layer with different stoichiometry). This segmentation allows each layer to perform specific functions (e.g., one layer for high mobility, another for low leakage), reducing overall surface leakage while maintaining manageable manufacturing complexity through sequential deposition processes
Data Source
AI summary
A thin film transistor includes an active layer and at least one gate stack. The active layer may be formed using multiple iterations of a unit layer stack deposition process, which includes an acceptor-type oxide deposition process and a post-transition metal oxide deposition process. A surface of each gate dielectric within the at least one gate stack contacts a surface of a respective layer of the oxide of the acceptor-type element so that leakage current of the active layer may be minimized. A source electrode and a drain electrode may contact an oxide layer providing lower contact resistance such as a layer of the post-transition metal oxide or a zinc oxide layer within the active layer.


