Electronic Modulating Device With Varying Insulator Thickness
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Solution Overview
Problem
Existing electronic modulating devices face issues with dielectric loss and metal ion diffusion due to the insulator in the modulating structure, which affect the performance and efficiency of electromagnetic wave transmission and reception.
Innovation Solution
An electronic modulating device is designed with an organic insulating layer of varying thickness within the openings defined by the electrode and buffer layer, which reduces dielectric loss and prevents metal ion diffusion by optimizing the thickness distribution to minimize the intensity of the electric field and control the diffusion of metal ions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a uniform thickness insulating layer is used in the electronic modulating device, then the manufacturing process is simple, but the dielectric loss is high and metal ion diffusion occurs
Solution Approach 1:
The insulating layer is designed with non-uniform thickness, having a first thickness at the first edge and a second thickness at the second edge, where the thickness varies continuously across the layer. This local variation in thickness optimizes the electric field distribution, reducing dielectric loss while preventing metal ion diffusion from the electrode through the insulating layer to the modulating material.
2Object-generated harmful factors
If the insulating layer thickness is increased to prevent metal ion diffusion, then metal ion diffusion is reduced, but the dielectric loss increases
Solution Approach 1:
The insulating layer employs different thicknesses at different locations: a greater thickness at edges adjacent to the electrode to prevent metal ion diffusion, and a reduced thickness in central regions to minimize dielectric loss. This spatially varying thickness profile simultaneously addresses both concerns.
Solution Approach 2:
The solution transitions from a one-dimensional uniform thickness parameter to a two-dimensional thickness profile, where the thickness varies across the surface of the insulating layer. This dimensional approach allows optimization of both metal ion diffusion prevention and dielectric loss reduction in different spatial regions.
3Loss of energy
If the insulating layer has varying thickness to reduce dielectric loss, then dielectric loss decreases, but the manufacturing precision requirements increase
Solution Approach 1:
The insulating layer's thickness parameter is deliberately changed across different spatial locations, creating a controlled gradient from the first edge to the second edge. This parameter variation is designed to reduce dielectric loss while the gradient profile is optimized to remain manufacturable with standard precision capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decreases dielectric loss and prevents metal ion diffusion, enhancing the performance of electromagnetic wave transmission and reception while maintaining the structural integrity of the modulating material.
Implementation Method 1
the organic insulating layer may have a first thickness at a first edge of the first electrode and a second thickness at a second edge of the first electrode, and the first thickness may be different from the second thickness... to decrease the dielectric loss of the electromagnetic wave
Implementation Method 2
the thickness of the organic insulating layer may be controlled to decrease the dielectric loss of the electromagnetic wave or to decrease the amount of metal ions diffusing into the modulating material
Data Source
AI summary
An electronic modulating device is provided, which includes a first substrate, an electrode, and an insulating layer. The electrode is disposed on the first substrate, wherein the electrode comprises an opening defining a top edge and a bottom edge of the electrode, and the opening has a central portion. The insulating layer is disposed on the electrode and within the opening. Wherein a thickness of the insulating layer at the bottom edge is greater than a thickness of the insulating layer at the central portion, and the electrode has a first inner side and at least a portion of the first inner side is uneven.