Modulation Device Power Supply Arrangement for Lithography
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Solution Overview
Problem
Charged particle lithography systems face challenges with unwanted magnetic fields generated by electrical currents in beamlet modulation devices, leading to writing errors due to deflection of electron beamlets, especially in small areas with high electrical power requirements.
Innovation Solution
A modulation device with a plate-like body, array of beamlet deflectors, and a power supply arrangement featuring a conductive slab with multiple thin conductive plates, where the power supply lines run perpendicular to the slab's face, minimizing magnetic fields by creating a configuration of parallel current sheets with equal forward and return currents, and using optical transmission of control signals to avoid vacuum interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If electrical power supply lines are arranged in conventional planar configuration on the modulation device, then power supply is provided to control circuits and beamlet deflectors, but magnetic fields are generated that deflect electron beamlets causing writing errors
Solution Approach 1:
The power supply lines are arranged in a three-dimensional configuration using stacked conductive layers rather than conventional planar arrangement. Multiple conductive layers are positioned at different heights (z-dimension) with alternating current directions, creating parallel current sheets that generate opposing magnetic fields which cancel each other out, thereby eliminating beamlet deflection while maintaining power supply functionality
Solution Approach 2:
The invention converts the harmful magnetic field effect into a beneficial cancellation mechanism. By arranging power supply lines to carry equal forward and return currents in parallel configurations, the magnetic fields generated by adjacent current-carrying conductors oppose each other and cancel out, transforming the previously harmful deflection effect into a neutral or beneficial field-cancellation mechanism that protects beamlet accuracy
2Productivity
If the modulation device area is increased to accommodate more beamlet deflectors for higher writing capacity, then more beamlets can be controlled, but the magnetic field effect becomes more significant causing greater writing errors
Solution Approach 1:
The invention enables scaling to larger modulation device areas by implementing a three-dimensional power supply architecture with multiple stacked conductive layers. This vertical arrangement allows power distribution across expanded device footprints while maintaining magnetic field cancellation through the layered configuration, thus supporting increased writing capacity without proportionally increasing magnetic field interference
Solution Approach 2:
The power supply system is segmented into multiple independent conductive layers, each carrying specific current paths. This segmentation allows independent optimization of each layer's magnetic field contribution and enables systematic cancellation across the entire device area, supporting scalable expansion to larger modulation devices with higher beamlet counts
3Power
If conventional power supply arrangements are used with long power supply lines, then power can be distributed to all components, but parasitic inductances increase and magnetic fields are enhanced
Solution Approach 1:
The invention transitions from two-dimensional planar power distribution to three-dimensional stacked conductive layers. This vertical arrangement dramatically shortens the physical path length for power delivery by routing currents through multiple layers in parallel, reducing the effective loop area and thereby minimizing parasitic inductance while maintaining comprehensive power distribution to all modulation device components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces magnetic fields, allowing for larger writing capacity with low-impedance connections, minimizing parasitic inductances, and maintaining high precision in pattern transfer by reducing deflection errors, thus enhancing the throughput and accuracy of charged particle lithography systems.
Implementation Method 1
the conductive slab comprises a plurality of thin conductive plates, wherein the conductive slabs forms part of the power supply arrangement... creating a configuration of parallel current sheets with equal forward and return currents
Implementation Method 2
the beamlets are modulated, for example by electrostatic deflection of the beamlets to switch selected beamlets on or off
Implementation Method 3
To enable high speed transfer of the pattern to the target surface, optical transmission of control signals to the modulation device may be used
Data Source
AI summary
The invention relates to a modulation device for modulating charged particle beamlets in accordance with pattern data in a multi-beamlet charged particle lithography system. The device comprises a plate-like body, an array of beamlet deflectors, a plurality of power supply terminals (202-205) for supplying at least two different voltages, a plurality of control circuits, and a conductive slab (201) for supplying electrical power to one or more of the power supply terminals (202-205). The plate-like body is divided into an elongated beam area (51) and an elongated non-beam area (52) positioned with their long edges adjacent to each other. The beamlet deflectors are located in the beam area. The control circuits are located in non-beam area. The conductive slab is connected to the control circuits in the non-beam area. The conductive slab comprises a plurality of thin conductive plates (202-205).