Optical Modulator Package Protrusions for Stress Distribution
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Solution Overview
Problem
Optical modulators with cutouts in their packages, when fixed to circuit boards, experience deterioration in optical and high-frequency characteristics due to processing distortions and stress concentration, leading to changes in the positional relationship of components and connection states, which are difficult to suppress through manufacturing conditions alone.
Innovation Solution
The optical modulator features a package with protruding bodies on its bottom surface for secure fixation, minimizing processing distortions and stress concentration by distributing the fixing force evenly, and incorporating signal input parts on upper protruding bodies to reduce signal propagation distance and high-frequency disturbances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a cutout is provided in the package of the optical modulator to secure space for electronic components, then the space utilization rate is improved, but processing distortion occurs in the package and stress concentration happens when fixed with screws, leading to deterioration of optical and high frequency characteristics
Solution Approach 1:
The bottom surface of the package is segmented into multiple protruding bodies (first, second, and third protruding bodies) that distribute the fixing stress to different locations, preventing stress concentration and package deformation while maintaining space utilization through the cutout structure
Solution Approach 2:
Different regions of the package bottom surface are given different structural qualities: protruding bodies in stress-bearing regions for fixation, and cutout regions for space utilization. This local differentiation allows simultaneous achievement of stable fixation and high space utilization rate
2Strength
If the package is fixed to the circuit board with screws, then secure fixation is achieved, but minute deformation occurs in the package depending on processing distortion and fastening force, causing deterioration of optical characteristics
Solution Approach 1:
The fixation function is segmented across multiple protruding bodies (first, second, and third protruding bodies) positioned at different locations on the package bottom surface. This distributes the screw fastening force across multiple points, preventing localized stress concentration and minimizing package deformation while maintaining overall fixation strength
Solution Approach 2:
The protruding bodies are designed in advance to compensate for potential processing distortions. By providing multiple protruding bodies with appropriate positioning, the structure preemptively cushions against deformation that might occur during screw fixation, ensuring the package maintains its flatness and optical characteristics
3Adaptability or versatility
If a cutout is provided in the package, then space for electronic components is secured, but the connection state between radio frequency connector and circuit board changes, causing deterioration of optical transmission characteristics
Solution Approach 1:
The package bottom surface is segmented into protruding bodies that maintain structural integrity and proper connection geometry. This segmentation ensures that even with a cutout present, the radio frequency connector maintains its correct connection state with the circuit board, preventing deterioration of optical transmission characteristics
Data Source
AI summary
An initial change and a secular change in an optical characteristic and a high frequency characteristic in a case where an optical modulator is mounted in a package of an optical transmission apparatus are suppressed while improving a space utilization rate in the package of the optical transmission apparatus. An optical modulator that is electrically connected to an electric circuit configured on a circuit board, includes a package that houses an optical modulation element, in which the package has, on a bottom surface facing the circuit board, a plurality of first protruding bodies protruding from the bottom surface.