Mach-Zehnder Modulator Resistor Groove Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Mounting termination resistors on a resin surface in optical devices can lead to variations in resistor characteristics due to height differences, making it difficult to integrate resistors with uniform characteristics monolithically with Mach-Zehnder modulators.
Innovation Solution
A Mach-Zehnder modulator design where the termination resistor is placed in a groove on the substrate rather than on the resin layer, with wiring connected through openings in the resin layer, ensuring a flat surface for resistor placement and reducing resistance variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the termination resistor is mounted on the resin surface, then the integration with Mach-Zehnder modulator is achieved, but the resistance characteristics vary due to surface height differences
Solution Approach 1:
The patent applies local quality by creating a groove in the resin layer specifically at the location where the termination resistor is to be mounted. This groove provides a localized flat surface area that is exempt from the general surface height variations of the resin, ensuring uniform resistance characteristics while maintaining overall integration.
Solution Approach 2:
The patent transitions from a two-dimensional surface mounting approach to a three-dimensional solution by excavating a groove into the resin layer. This dimensional change creates a new mounting plane at a different depth level, isolating the resistor from surface irregularities while maintaining electrical connection through the resin structure.
2Adaptability or versatility
If the termination resistor is integrated monolithically with the Mach-Zehnder modulator, then device integration is improved, but resistance characteristics become non-uniform due to resin surface variations
Solution Approach 1:
By creating a localized flat surface through groove formation, the patent ensures that the specific region where the termination resistor is mounted has uniform characteristics, while the rest of the resin layer can maintain its flexible, integrated structure for device adaptability.
Solution Approach 2:
The groove structure introduces a vertical dimension to the integration process, allowing the resistor to be mounted on a controlled plane within the resin rather than on the external surface, thus achieving both integration and consistency.
3Manufacturing precision
If the termination resistor is placed on a flat substrate surface, then resistance uniformity is improved, but integration with the Mach-Zehnder modulator on resin is compromised
Solution Approach 1:
The groove creates a localized flat region within the resin layer, combining the benefits of substrate-level uniformity with resin-level integration. The flat groove surface ensures resistance uniformity while the resin surrounding the groove maintains the integrated modulator structure.
Solution Approach 2:
The groove acts as an intermediary structure between the substrate and the resin surface, providing a transition zone that allows the termination resistor to be positioned with high precision while remaining integrated within the resin-based modulator architecture.
Data Source
AI summary
A modulator including: a Mach-Zehnder modulator that includes an optical waveguide disposed on a substrate, the optical waveguide including an electrode thereon; a resin layer disposed on the substrate, the resin layer embedding the optical waveguide, the resin layer having a groove arranged besides the optical waveguide; a termination resistor disposed on the substrate in the groove of the resin layer; and a first wiring disposed on the resin layer, the first wiring being connected to the termination resistor and the electrode of the optical waveguide.