Electronic Module Airflow Cooling and Debris Containment
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Solution Overview
Problem
Existing electronic modules fail to effectively lower the temperature of internal components, leading to potential overheating and failure, as external air movement alone is insufficient in dissipating heat generated by internal components.
Innovation Solution
An electronic module design featuring a chassis with capacitors, bus bars, and a heat sink, where airflow sequentially contacts these components before exiting, enhanced by a fan to generate forced air cooling, and a robust chassis to contain any debris from component failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external air movement is used to dissipate heat from electronic modules, then some heat dissipation is achieved, but the temperature of internal components remains too high
Solution Approach 1:
The electronic module is divided into distinct functional zones along the airflow path: capacitor region at the inlet, heat sink region in the middle, and bus bar region at the outlet. This segmentation allows each component to be optimally positioned for heat dissipation, with capacitors cooled first by incoming air, followed by the heat sink, and then bus bars, effectively addressing the temperature control problem for internal components
Solution Approach 2:
The patent transitions from two-dimensional external air movement to three-dimensional internal airflow routing. By creating a dedicated airflow path that moves through the interior of the chassis and sequentially contacts multiple heat-generating components, the system achieves comprehensive cooling that external airflow alone cannot provide, directly solving the overheating issue
2Object-affected harmful factors
If a robust chassis is used to contain failure debris, then damage to adjacent components is minimized, but the device complexity increases
Solution Approach 1:
The chassis is designed to simultaneously serve multiple functions: structural support for mounting components, containment vessel for failure debris, and airflow duct for heat dissipation. By merging these functions into a single integrated structure rather than separate components, the patent minimizes device complexity while still providing robust failure containment
Solution Approach 2:
The chassis is designed as a multi-functional component that provides mechanical support, thermal management pathways, and safety containment all in one structure. This universal design approach allows the same chassis to handle both normal operation (heat dissipation) and abnormal conditions (failure containment) without requiring additional specialized structures, thereby avoiding increased complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat from internal components, reduces the risk of overheating, and contains any failure debris within the chassis, minimizing damage to adjacent components and ensuring reliable operation.
Implementation Method 1
a portion of the airflow sequentially comes in contact with the capacitors, the heat sink, and the bus bars
Implementation Method 2
The heat sink is positioned between the capacitors and the bus bars
Data Source
AI summary
An electronic module. The electronic module includes a chassis, a plurality of capacitors, a plurality of bus bars, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The capacitors are positioned within the chassis, and at least one of the capacitors is proximate the first end. The bus bars are positioned within the chassis proximate the second end. The heat sink is positioned between the capacitors and the bus bars. The capacitors, the heat sink and the bus bars are positioned such that when an airflow enters the chassis at the first end, a portion of the airflow sequentially comes in contact with the capacitors, the heat sink, and the bus bars before exiting at the second end.