Semiconductor Module Base Plate Brazing for Sealed Cooling
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Solution Overview
Problem
Existing methods for constructing semiconductor components with multiple modules face challenges in efficient cooling and fluid-tight connections, particularly due to high temperatures during welding processes which can damage wire bonds and result in complex, large structures.
Innovation Solution
A method involving laser brazing of semiconductor modules' base plates to a support frame using a solder with a melting point of at least 450 °C, where the solder is melted by heating the support frame locally, creating a robust and fluid-tight connection that allows for effective cooling and simplifies the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If welding is used to connect base plates to cooling channels, then strong mechanical connection is achieved, but high temperatures damage wire bonds and require complex cooling system design
Solution Approach 1:
The patent introduces solder as an intermediary material between the base plate and cooling channel. This solder layer enables the connection process to occur at lower temperatures (melting point of solder) rather than welding temperatures, thereby protecting the wire bonds from thermal damage while still achieving a strong mechanical and thermal connection through the intermediary solder joint.
2Reliability
If welding is used to ensure fluid-tight connections, then sealing is achieved, but the assembly becomes unnecessarily large and design becomes complex
Solution Approach 1:
The solder acts as an intermediary that simultaneously provides both mechanical bonding and fluid-tight sealing in a single step. This eliminates the need for separate sealing mechanisms or complex welding procedures, simplifying the overall cooling system design while ensuring reliable fluid-tight connections between components.
3Strength
If sintering is used to bond semiconductor components, then strong bonding is achieved, but wire bonds are destroyed by the pressure and temperature
Solution Approach 1:
The patent segments the bonding process into two separate stages: first, wire bonding is performed at low temperatures to create electrical connections; second, sintering is performed later to create strong mechanical bonds between components. This temporal segmentation allows each process to occur under optimal conditions without the harmful effects of the other, achieving both strong bonding and preserved wire bonds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient cooling of semiconductor modules by forming a sealed fluid channel and reduces the complexity of assembly, achieving a robust and fluid-tight connection without excessive heating of semiconductor components, allowing for the integration of multiple modules into a compact semiconductor component.
Implementation Method 1
the soldering of the respective base plate to the support frame is carried out by laser brazing, wherein the laser is irradiated onto the side of the support frame facing away from the base plate, whereby the support frame is locally heated and the solder is melted by the heated support frame
Implementation Method 2
the solder is melted by heating the support frame locally, creating a robust and fluid-tight connection
Data Source
Figure 1~2
Figure 3~4
AI summary
Semiconductor component comprising a support frame (2) and at least one semiconductor module (3) attached to the support frame (2), wherein the support frame (2) has a respective opening (6) on the edge (7) of which a base plate (4) of the semiconductor module (3) rests, wherein the base plate (4) is soldered to the support frame (2).