Module Board Terminal Placement for Resin Depression Control
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Solution Overview
Problem
Existing module boards face challenges in maintaining a flat top face of insulating resin near the center of the substrate due to uneven resin thickness, leading to accumulation of flux resin and air entrainment when columnar connection terminals are only arranged on the peripheral area, which complicates the flattening process.
Innovation Solution
Arranging multiple columnar connection terminals not only on the peripheral area but also in small areas between electronic components on the substrate, optimizing their placement to maintain a flat resin surface and reduce resin depression near the center, thereby simplifying the resin flattening process and preventing air entrainment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If columnar connection terminals are arranged only on the peripheral area of the substrate, then the manufacturing process is simple, but the insulating resin thickness becomes non-uniform causing depression near the center
Solution Approach 1:
The patent applies local quality by differentiating the arrangement of columnar connection terminals between peripheral areas and central areas. Specifically, terminals are arranged in a first arrangement in peripheral areas and a second arrangement in central areas, with the second arrangement having a greater density or different pattern to locally compensate for resin depression. This localized differentiation ensures uniform insulating resin thickness across the entire substrate while maintaining manufacturing feasibility.
2Device complexity
If columnar connection terminals are arranged only on the peripheral area, then the structure is simple, but resin flattening becomes difficult and air entrainment occurs
Solution Approach 1:
The patent implements local quality by introducing a second arrangement of columnar connection terminals in central areas with different characteristics from the first arrangement in peripheral areas. The second arrangement is specifically designed to prevent resin depression and eliminate air pockets during the sealing process, thereby improving resin sealing quality and preventing air entrainment without significantly increasing overall device complexity.
3Reliability
If columnar posts are scattered to improve sealing effect, then the sealing effect improves, but the possibility of reducing resin thickness depression near the center is not cleared
Solution Approach 1:
The patent applies local quality by creating distinct terminal arrangements for different regions: the first arrangement in peripheral areas provides basic sealing, while the second arrangement in central areas specifically addresses resin thickness uniformity. This regional differentiation ensures both improved sealing effect and reduced resin depression near the center, clearing the uncertainty about achieving thickness uniformity.
Data Source
AI summary
To provide a module board capable of suppressing depression of a top face of insulating resin near the center of a substrate by arranging multiple columnar connection terminals not only on a peripheral area of the substrate but also between multiple electronic components that are mounted. Multiple electronic components 4 and 4h are mounted on one face of a substrate 5 and the multiple electronic components 4 and 4h are sealed with insulating resin 3. Multiple columnar connection terminals 2 and 7 are arranged on a peripheral area of the substrate 5 and in one or more small areas 8 on the substrate 5, respectively. The one or more small areas 8 are set at positions on the substrate 5, which is not on the peripheral area of the substrate 5 and on which the multiple electronic components 4 and 4h are not mounted.