Electronic Module Bonding Layout to Prevent Solder Short Circuits
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Solution Overview
Problem
Short-circuit failures occur during the manufacturing of electronic modules due to bonding members connecting electrodes of electronic components to wiring boards, leading to noise issues as transmission signals increase in speed and decrease in voltage.
Innovation Solution
The electronic module design includes a first and second bonding member that bonds electrodes to pads on an insulating area defined by an insulating member, with the distance between the electrodes and the insulating member being smaller than the distance to the pads, and a method of manufacturing involving solder pastes that form bonding members after heating and cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bonding member bonds an electrode of an electronic component to a wiring board, then electrical connection is achieved, but short-circuit failure may occur between bonding members
Solution Approach 1:
The patent introduces an insulating member as an intermediary element positioned between the electrode and the wiring board. This insulating member includes an insulating area that physically separates the bonding member from adjacent bonding members, preventing short-circuit failures while still allowing the bonding member to establish electrical connection through the insulating member to the underlying pad structure
Solution Approach 2:
The patent moves the bonding interface from a direct planar contact between bonding member and pad to a three-dimensional structure where the bonding member connects to the insulating member, which in turn connects to the pad through vias. This dimensional transition allows electrical connection while maintaining physical separation from adjacent bonding members
2Speed
If transmission signals increase in speed and decrease in voltage, then signal transmission capability is improved, but noise produced by the electronic module increases
Solution Approach 1:
The patent extracts the insulating function from the traditional direct bonding structure and creates a separate insulating member. This isolation prevents noise generated by adjacent bonding members and high-speed signal traces from coupling through the wiring board, thereby reducing electromagnetic interference while maintaining high-speed signal transmission capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces short-circuit failures and noise by ensuring secure electrode connections on insulating areas, enhancing signal speed and reducing power supply noise.
Implementation Method 1
forming a first molten solder and a second molten solder by melting the first solder paste and the second solder paste by heating the first solder paste and the second solder paste
Implementation Method 2
forming a first bonding member and a second bonding member by solidifying the first molten solder and the second molten solder by cooling the first molten solder and the second molten solder
Data Source
AI summary
An electronic module includes a first wiring component, a first electronic component, a first bonding member, and a second bonding member. The first wiring component includes a first pad, a second pad, and a first insulating member. The first pad, the second pad, and the first insulating member are formed in a first mounting surface. The first electronic component includes a first electrode and a second electrode and is surface-mounted on the first mounting surface. The first bonding member is configured to bond the first pad and the first electrode together. The second bonding member is configured to bond the second pad and the second electrode together. The first electrode and the second electrode are positioned on an insulating area of the first mounting surface. A distance between the first electrode and the first insulating member is smaller than a distance between the first electrode and the first pad.