Electronic Component Module Cap Removal Without Grinding Dust
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Solution Overview
Problem
The existing manufacturing process for electronic component modules faces issues such as the lid portion of the cap being pressed into the cap without being completely cut, leading to burrs that trap the lid portion and make it difficult to remove, and the generation of grinding dust that can cause malfunctions in the exposed component.
Innovation Solution
The proposed method involves forming a cap with a side wall portion, a lid portion, a thin portion around the lid portion, and a beam portion that supports the lid portion. During grinding, the beam portion holds the lid portion in place, preventing it from being pressed inside the cap. An adhesive sheet is then applied to the lid portion, and the beam portion is cut through the adhesive sheet, allowing the lid portion to be easily peeled off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the lid portion is ground to reduce thickness until the thin portion disappears, then the lid portion can be removed, but the lid portion is pressed into the cap by grinding pressure and trapped by burrs making removal difficult
Solution Approach 1:
The cap is divided into distinct portions: the lid portion (12) that needs to be removed, the side wall portion (11) that remains, and the beam portion (14) that acts as a support structure. This segmentation allows the lid portion to be ground and removed separately without being trapped by burrs generated during grinding, as the beam portion provides a clean separation interface.
Solution Approach 2:
The beam portion (14) serves as an intermediary element between the lid portion (12) and the side wall portion (11). During grinding, the beam portion supports the lid portion and prevents it from being pressed into the cap body, thereby preventing burr formation that would trap the lid portion and facilitate clean removal.
2Ease of operation
If the lid portion is ground to expose the component, then the component can be accessed, but grinding dust enters the cap and causes malfunction
Solution Approach 1:
The lid portion (12) is extracted or removed from the cap structure through controlled grinding. This allows access to the exposed component (20) while preventing grinding dust from entering the cap interior, since the lid portion acts as a protective cover during the grinding process and is removed only after the necessary thickness reduction is achieved.
Solution Approach 2:
The lid portion (12) is ground to the required thickness before complete removal. This preliminary action reduces the lid thickness while it still serves as a protective barrier, preventing grinding dust from entering the cap and contaminating the exposed component (20) during the grinding process.
3Reliability
If the cap is sealed with resin to protect components, then protection is provided, but the lid portion cannot be removed after sealing
Solution Approach 1:
The cap structure is segmented into the lid portion (12) and the side wall portion (11) connected by the beam portion (14). This segmentation allows the lid portion to be designed for removable sealing - it can be attached to provide protection during assembly and transport, then removed after sealing to allow component access, while the side wall portion remains as the permanent structural element.
Data Source
AI summary
A cap including a side wall portion having conductivity, a lid portion, a thin portion formed at least around the lid portion, and a beam portion supporting the lid portion is formed, an exposed component and a sealing component are mounted on a module substrate, the cap is mounted on the module substrate so as to surround an exposed component, the sealing component and the cap are sealed with a sealing resin, the lid portion is ground so as to reduce its thickness until the thin portion disappears, a shield layer is formed on an outer surface of the sealing resin and a side surface of the module substrate, a translucent adhesive sheet is attached on a top surface of the sealing resin, the beam portion is cut by laser through the adhesive sheet, and the adhesive sheet is peeled together with a lid portion.