Semiconductor Module Case Gate Layout for Void-Free Resin Filling
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Solution Overview
Problem
In high-capacity semiconductor modules, the increased size of the case necessitates rapid resin supply during molding, which can lead to resin voids or insufficient thickness due to fast injection speeds, and changing injection molding conditions poses constraints.
Innovation Solution
A semiconductor module case with a single, flat, film-shaped gate on a side face and a resin channel system that allows for efficient resin flow, ensuring uniform filling and reducing resin voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If injection speed is increased to supply sufficient resin in a short time, then resin fill rate is improved, but air is introduced into the mold creating resin voids
Solution Approach 1:
The injection system is segmented into multiple gates distributed across the mold, allowing resin to enter through multiple points simultaneously. This segmentation enables sufficient resin supply to large molds without requiring excessively high injection speeds at a single gate, thereby preventing air entrapment and resin void formation while maintaining high fill rates.
2Volume of moving object
If case size is increased for high-capacity modules, then semiconductor element capacity is improved, but resin supply difficulty increases
Solution Approach 1:
Large case volumes are serviced by multiple gates that segment the resin supply path. Each gate handles a portion of the total resin flow requirement, enabling efficient filling of large-volume molds without overloading a single injection point, thus maintaining productivity despite increased case size.
Solution Approach 2:
Instead of relying solely on increasing injection speed (one-dimensional solution), the patent introduces a multi-dimensional approach by distributing multiple gates across different locations on the mold. This spatial distribution across multiple dimensions enables efficient resin supply to large cases while avoiding the harmful effects of excessive single-point injection speeds.
3Manufacturing precision
If injection speed is decreased to prevent air introduction, then resin void formation is reduced, but resin fill time increases
Solution Approach 1:
Multiple gates segment the resin injection process, allowing parallel filling of different mold regions. This segmentation maintains short cycle times because resin injection occurs simultaneously through multiple paths rather than sequentially through a single gate, while keeping individual gate speeds moderate enough to prevent air entrapment and resin voids.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables sufficient resin supply in a short time, producing a high-quality molded product with reduced defects and improved strength.
Implementation Method 1
Injection molding technology for example is used in mass production of the case used in a semiconductor module. In injection molding, a hot molten resin is injected into a mold, and a desired molded product is created through steps such as pressurizing, cooling, and solidifying
Implementation Method 2
a resin channel portion connected to the case, wherein the resin channel portion includes a runner that forms a channel for the resin connected to the first gate
Data Source
AI summary
A semiconductor module case formed by injection molding into a box shape using a mold open on a bottom thereof, includes an external terminal disposed on a top face or a side face of the case, the external terminal penetrating through the case from an inside to an outside thereof and being electrically connectable to a semiconductor element inside of the case, and a single first gate for a resin to enter the case. The case has a rectangular shape in a plan view of the case and has first and second short sides and first and second long sides, and the first gate is disposed at a side face of the first short side and has a flat surface area having a first width that extends along the first short side in a width direction of the case.