Semiconductor Module Case Rib Layout for Warpage Suppression
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Solution Overview
Problem
The rib structure of existing semiconductor modules, consisting of a single frame-shaped rib, is inadequate in reinforcing the case to prevent warpage due to thermal displacement, which increases with the enhanced performance and information processing demands of semiconductors.
Innovation Solution
A semiconductor module with a case reinforced by a plurality of ribs extending from terminal blocks, including inner, outer, and intermediate ribs, which are designed to connect and reinforce the inner, outer, and intermediate portions of the case, with specific configurations to enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a single frame-shaped rib structure is used to reinforce the case, then the manufacturing complexity is low, but the case warpage suppression is insufficient under increased thermal stress
Solution Approach 1:
The single frame-shaped rib is segmented into multiple ribs (first inner ribs, second inner ribs, first outer ribs, second outer ribs, and intermediate ribs) that extend from the terminal blocks in different directions. This segmentation allows each rib to target specific high-stress areas, improving overall warpage suppression while maintaining manageable structural complexity through modular design
Solution Approach 2:
Different rib configurations are applied to different locations of the case based on local stress requirements. Inner ribs reinforce the inner edge near the substrate, outer ribs reinforce the outer edge, and intermediate ribs reinforce middle sections. This localized reinforcement approach optimizes warpage suppression efficiency without uniformly increasing complexity across the entire structure
2Reliability
If multiple ribs are added to reinforce the case, then the case strength is improved, but the manufacturing complexity increases
Solution Approach 1:
The terminal blocks serve multiple functions: they provide electrical connections and simultaneously act as mounting structures for the ribs. The ribs themselves serve dual purposes of structural reinforcement and thermal management pathways. This multi-functionality reduces the need for separate components, improving reliability without proportionally increasing manufacturing complexity
Solution Approach 2:
Multiple ribs are merged into a integrated reinforcement system that works collectively to suppress warpage. The ribs are combined with the terminal blocks and case structure to form a unified load-bearing network. This merging allows the structure to achieve high reliability through synergistic reinforcement rather than through the simple accumulation of independent rib elements
Data Source
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AI summary
[Problem] The purpose is to provide a semiconductor module in which a case is reinforced and warpage can be suppressed by providing a plurality of ribs extending from ends of a terminal block. [Solution] In a semiconductor module 1 according to the present invention, a case 20 is attached in an annular manner around an edge 11 of a substrate 10. The semiconductor module 1 is characterized in that the case 20 has a terminal block 30, inner ribs 50, outer ribs 60, and intermediate ribs 70, and a plurality of inner ribs 50, a plurality of outer ribs 60, and a plurality of intermediate ribs 70 are provided so as to extend from the terminal block 30.