Electronic Component Module Shielding via Conductive Posts
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Solution Overview
Problem
Existing electronic component modules with shielding layers require space for conductive members like pin-shaped ground terminals or block partitioning members, limiting the reduction in size of the circuit substrate and the module.
Innovation Solution
The module incorporates conductive posts on surface mount components that connect them directly to a conductor layer on the resin layer, eliminating the need for pre-formed holes in the resin layer and allowing for a more compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pin-shaped ground terminal or block partitioning member is provided on the circuit substrate to connect to the conductor film, then the shielding effect is achieved, but the circuit substrate size cannot be reduced
Solution Approach 1:
The invention transitions the connection structure from a planar configuration (conductive members on the substrate surface) to a three-dimensional configuration (conductive posts extending vertically through the resin layer). This dimensional change allows the conductor layer to be positioned on the resin layer surface rather than requiring substrate surface space, thereby achieving shielding without increasing substrate area
Solution Approach 2:
The conductive posts are embedded within the resin layer, with portions extending through it. This nesting approach integrates the connection structure into the existing resin encapsulation, eliminating the need for separate substrate-mounted conductive members and enabling compact integration of the shielding function
2Reliability
If the circuit substrate is directly connected to the conductor film through a conductive member, then electrical connection is achieved, but space on the circuit substrate is wasted
Solution Approach 1:
The electrical connection path is moved from the substrate plane to the vertical dimension, with conductive posts extending upward through the resin layer to connect with the conductor layer. This eliminates the need for substrate surface space while maintaining reliable electrical connection
Solution Approach 2:
The connection function is replicated from the substrate level to the resin layer level through the conductive posts, allowing the conductor layer to be positioned on the resin layer surface rather than requiring substrate-mounted connection elements
Data Source
AI summary
An electronic component module includes a circuit substrate including surface mount components mounted thereon, a resin layer embedding the surface mount components, and a conductor layer provided on a surface of the resin layer, wherein a conductive post is provided on the surface mount component, and an external electrode having a ground potential provided on the surface mount component is conductively connected to the conductor layer through the conductive post, whereby the conductor layer defines a shielding layer.