Module Connector Covers to Prevent Reflow Pin Film Buildup

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Solution Overview

Problem

The reflow soldering process used to connect connector pins to a printed circuit board can result in the formation of a non-conductive film on the pins due to vaporized organic-based dust or resin, leading to intermittent electrical connections and the need for repeated insertion of memory modules to establish a reliable connection.

Innovation Solution

The use of removable high-temperature covers over the connector cavities during the reflow soldering process to prevent foreign objects and vaporized materials from depositing a non-conductive film on the connector pins, ensuring a consistent electrical connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If reflow soldering process is used to connect connector pins to PCB, then reliable electrical connection is achieved, but non-conductive film forms on connector pins due to vaporized organic materials

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidnon-conductive film formation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A cap is introduced as an intermediary component that covers the connector cavity during reflow soldering. The cap acts as a physical barrier between the vaporized organic materials and the connector pins, preventing the harmful deposition while allowing the soldering process to proceed normally. The cap is temporarily placed and removed, serving its protective function without becoming part of the final assembly.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The cap creates a protected environment or 'inert space' within the connector cavity during reflow soldering. By covering the cavity, it isolates the connector pins from the harmful atmospheric conditions (vaporized organic materials) present in the soldering environment, effectively creating a localized safe zone that prevents contamination.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Productivity

If reflow soldering is performed without protection, then manufacturing process is simple and fast, but connection reliability deteriorates due to film deposition

Engineering Contradiction:

Improvemanufacturing speedVSAvoidpin connection reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The cap is placed on the connector cavity before the reflow soldering process begins. This preliminary protective action ensures that the connector pins are shielded from contamination throughout the entire soldering process, preventing the formation of non-conductive films before they can occur, thereby ensuring reliability without complicating the manufacturing workflow.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The cap serves as a temporary intermediary that enables the reflow soldering process to proceed at normal speed while simultaneously protecting the connector pins. The addition of this simple component does not significantly slow down manufacturing but ensures reliable connections by preventing film formation during the critical soldering phase.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If module is inserted repeatedly to establish connection, then non-conductive film can be removed, but system stability decreases and boot failures occur

Engineering Contradiction:

Improveconnection establishmentVSAvoidsystem stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The cap prevents the harmful deposition process before it can occur in the first place, rather than requiring corrective actions after the fact. By blocking the vaporized organic materials from contacting the connector pins during soldering, the need for repeated module insertion to remove films is eliminated, ensuring both reliable connection establishment and system stability from the outset.

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces the formation of non-conductive films on connector pins, enhancing the reliability of electrical connections and eliminating the need for repeated module insertion, thereby improving system stability and reducing the likelihood of boot failures.

Implementation Method 1

heating the connector pin and a solder ball or paste of an SMP pad to temperatures between 200 to 260 Celsius... organic-based dust or resin that may have vaporized during the reflow soldering process

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

a non-conductive film can form on at least a portion of the connector pin... vaporized organic-based dust or resin that may have vaporized during the reflow soldering process

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS20240421516A1Techniques for a module connector design to improve pin connection

Publication Date: 2024.12.19 INTEL CORP

AI summary

Examples include techniques for a module connector design to improve pin connection. The techniques include covering top and bottom cavities of a connector that includes connector pins arranged to be coupled with a printed circuit board via a reflow soldering process to prevent a film from forming on the connector pins during or after the reflow soldering process.