Electronic Module Container Assembly in a Single Production Device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production of containers for electronic modules is costly due to the need for multiple production stations and separate processing of plastic and metallic parts, increasing overall production expenses.
Innovation Solution
A method where both the upper and lower parts of the container, along with the receiving element, are produced and assembled within a single production device, utilizing reshaping techniques such as deep-drawing and punching, allowing for integrated fabrication and reduced tool costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If container parts are produced in multiple different production stations using injection molding and sintering techniques, then manufacturing precision and quality are maintained, but production costs increase
Solution Approach 1:
The patent combines multiple production stations into a single integrated production device that can perform injection molding, sintering, and assembly operations sequentially. The processing device includes multiple processing regions (first processing region for injection molding, second processing region for sintering) that are integrated into one system, allowing container parts to be produced and assembled without transferring between separate production stations, thereby reducing overall device complexity and production costs.
Solution Approach 2:
The production device is designed as a universal system that can handle both plastic components (via injection molding) and metallic components (via sintering) within the same device. The device includes versatile processing regions that can accommodate different materials and manufacturing techniques, making it a multi-functional production system that eliminates the need for separate specialized production stations.
2Productivity
If electronic modules are inserted into separately produced containers and then sealed, then product reliability is ensured, but production time increases
Solution Approach 1:
The patent performs preliminary actions by producing the container parts and inserting the electronic modules within the same integrated production device before final sealing. The receiving element is fed into the first processing region, the lower part receives the receiving element, and the upper part is fed into the first processing region, all within the same production cycle. This preliminary integration of assembly operations into the production process reduces subsequent handling and sealing time while maintaining reliability through controlled sealing conditions.
Solution Approach 2:
The production process maintains continuity by performing injection molding, sintering, module insertion, and sealing operations in a continuous sequence within the same production device. The processing device transitions smoothly between different processing regions and operations without interrupting the production flow, ensuring that container parts are produced and assembled continuously, thereby reducing total production time while maintaining consistent quality through uninterrupted processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and enables efficient assembly of electronic modules by integrating the production of container parts and modules in a single device, minimizing tool expenses and logistics, while allowing for the use of thin metallic parts and film-based production.
Implementation Method 1
the reshaping comprises deep-drawing
Implementation Method 2
the lower part is created from a first starting material and/or the upper part is created from a second starting material by punching or stamping
Data Source
AI summary
A method for producing a container having an upper part, a lower part and a receiving element such as an electronics module includes the following steps: the lower part is created from a first starting material in a first processing region of a processing device; the upper part is created from a second starting material in a second processing region of the processing device; the receiving element is fed into the first processing region of the processing device; the lower part receives the receiving element in the first processing region of the processing device; the upper part is fed from the second processing region into the first processing region of the processing device; and there the upper part and the lower part are joined together to form the container.