Semiconductor Module Cooler Clamping for Quake Resistance
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Solution Overview
Problem
The existing semiconductor device configuration has insufficient quake resistance due to inadequate elastic deformation of the sandwiching members, which affects the holding of the cooler.
Innovation Solution
The semiconductor device includes one or more semiconductor modules arranged in a row, paired cooling members, and paired sandwiching members with support portions and spring portions that couple to each other, enhancing the pressing force against the cooling members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sandwiching members are fixed with fixing members from two sides only, then the structure is simple, but the elastic deformation of the curved portions is insufficient and quake resistance is poor
Solution Approach 1:
The sandwiching member is divided into multiple base portions (first, second, and third base portions) with curved portions between them. This segmentation allows each curved portion to independently deform elastically, distributing the shock absorption across multiple points rather than relying on a single fixed structure.
Solution Approach 2:
Different portions of the sandwiching member have different functions: the first and second base portions are fixed to the opposing sandwiching member to provide stable anchoring points, while the third base portion remains movable to enable elastic deformation of the curved portions. This local differentiation optimizes both structural stability and shock absorption.
2Reliability
If the base portion at the center is not biased by fixing portions, then the fixing structure is simpler, but the elastic deformation of the curved portions is insufficient
Solution Approach 1:
The first and second fixing portions are pre-configured to bias the first and second base portions toward the cooler before any shock or vibration occurs. This preliminary positioning ensures that the curved portions are pre-loaded and ready to deform elastically when subjected to external forces, enhancing the holding capability of the cooler.
3Force
If multiple support portions and spring portions are added to the sandwiching members, then the pressing force and quake resistance are improved, but the device complexity increases
Solution Approach 1:
The support portions and spring portions are integrated into a single sandwiching member structure rather than being separate components. The first, second, and third base portions are all part of the same sandwiching member, with curved portions connecting them. This merging reduces the number of discrete parts while maintaining the complex functionality needed for enhanced pressing force and quake resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the quake resistance by ensuring uniform and increased pressing force on the cooling members, effectively enhancing the holding capability of the cooler.
Implementation Method 1
the spring portion extending from each of the plurality of support portions in an arrangement direction of the semiconductor modules and abutting the cooling member
Data Source
AI summary
A semiconductor device includes: one or more semiconductor modules arranged in a row; a pair of cooling members disposed so as to sandwich the semiconductor modules and configured to cool the semiconductor modules; a pair of sandwiching members each disposed on an opposite side of the semiconductor module across a corresponding one of the pair of cooling members to oppose the corresponding one of the pair of cooling members; and a coupling portion that couples a pair of sandwiching members to each other and presses each of the pair of sandwiching members against the opposing one of the cooling members, in which at least one of the pair of sandwiching members includes a plurality of support portions disposed to oppose ends of the arranged semiconductor modules and a space between the semiconductor modules, and a spring portion extending from each of the plurality of support portions in an arrangement direction of the semiconductor modules and abutting the cooling member, and the coupling portion couples the support portion provided to the one of the pair of sandwiching members and another sandwiching member.