Vehicle Intelligent Module Cooling to Prevent Condensation
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Solution Overview
Problem
Current heat dissipation methods for vehicle-mounted intelligent modules, such as natural and air cooling, are inadequate to meet the increasing heat dissipation requirements due to higher computing power and power consumption, leading to limited heat dissipation capabilities and potential condensation issues.
Innovation Solution
A heat dissipation apparatus combining air cooling and liquid cooling modes, with a first plate body connected to multiple liquid cooling loops, allowing selective switching between air and liquid cooling based on temperature conditions to avoid condensation and enhance heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If natural cooling or air cooling mode is used, then the structure is simple, but the heat dissipation capability is limited and cannot meet the increasing heat dissipation requirements
Solution Approach 1:
The patent implements dynamic switching between air cooling and liquid cooling modes based on real-time temperature monitoring. The system transitions from a static cooling approach to a dynamic one where the cooling mode is adjusted according to the intelligent module's temperature state, thereby resolving the contradiction between structural simplicity and heat dissipation capability.
Solution Approach 2:
The heat dissipation apparatus is designed to perform multiple functions: it can operate in air cooling mode for low-temperature scenarios and switch to liquid cooling mode for high-temperature scenarios. This multi-functionality allows the system to meet varying heat dissipation requirements without requiring separate dedicated systems, thus maintaining relative structural simplicity while enhancing overall heat dissipation capability.
2Temperature
If liquid cooling mode is used, then the heat dissipation capability is strong, but condensation phenomenon may occur causing short circuit
Solution Approach 1:
The system incorporates temperature sensing and control mechanisms that continuously monitor the intelligent module's temperature and provide feedback to the control unit. Based on this feedback, the system determines whether to activate liquid cooling and when to switch between cooling modes, thereby preventing condensation-induced short circuits while maintaining effective heat dissipation.
Solution Approach 2:
The control unit evaluates temperature conditions before activating liquid cooling mode. By performing preliminary assessment of the temperature state and switching conditions, the system avoids premature or inappropriate activation of liquid cooling that could lead to condensation, thus preventing short circuits before they occur.
3Reliability
If air cooling mode is used, then condensation is avoided, but the heat dissipation effect is not ideal
Solution Approach 1:
The system dynamically adjusts the cooling mode based on real-time temperature conditions. When the intelligent module's temperature exceeds the switching threshold, the system transitions from air cooling to liquid cooling, and when the temperature drops below the threshold, it switches back to air cooling. This dynamic adaptation ensures optimal heat dissipation effect while avoiding condensation issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively enhances heat dissipation capabilities, prevents condensation, and ensures safe operation of intelligent modules by dynamically switching between cooling modes, reducing the risk of short circuits and lowering the need for high ingress protection ratings.
Implementation Method 1
the first plate body may be located in a plurality of liquid cooling loops... the air cooling part and/or the first plate body may dissipate heat for the intelligent module
Implementation Method 2
a liquid cooling loop in the plurality of liquid cooling loops meets a connection condition... dissipate heat for the intelligent module
Implementation Method 3
an air cooling part... the air cooling part and/or the first plate body may dissipate heat for the intelligent module
Data Source
AI summary
A heat dissipation apparatus, a vehicle, and a heat dissipation control method are disclosed. The heat dissipation apparatus includes a housing and an air cooling part. The housing includes a first plate body, an intelligent module close to the first plate body is disposed in the housing, and the air cooling part and the intelligent module are disposed on a same side of the first plate body. The first plate body has a first cavity inside, the first plate body is located in a plurality of liquid cooling loops, and the air cooling part and/or the first plate body are/is configured to dissipate heat for the intelligent module. In addition, the first plate body may be connected to an appropriate liquid cooling loop to avoid a condensation phenomenon of the intelligent module when the liquid cooling heat dissipation mode is used for the intelligent module.