Module Cooling System With Stiffener Biasing
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Solution Overview
Problem
Existing module-to-heatsink mounting arrangements for electronic components are complex, expensive, and take up valuable space, lacking a simple and cost-effective method to efficiently manage the thermal interface gap and distribute mechanical forces.
Innovation Solution
A module cooling system that includes a stiffener abutting the circuit board, a heatsink attached to the module with a central biasing member and non-influencing fasteners, and a second biasing member to uniformly apply force between the circuit board and heatsink, ensuring efficient heat dissipation and reduced mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional attachment mechanisms (clamps, screws) are used to attach heatsink to module, then the thermal interface gap can be controlled, but the device complexity increases and valuable space is consumed
Solution Approach 1:
The patent combines multiple functions into the stiffener component: it provides mechanical support for the circuit board, serves as a mounting structure for the heatsink, and acts as a force distribution element. This integration eliminates the need for separate clamps, screws, and other hardware components, thereby reducing device complexity while maintaining thermal interface gap control through the biased attachment arrangement.
Solution Approach 2:
The stiffener is designed as a multi-functional component that simultaneously supports the circuit board mechanically, provides a mounting surface for the heatsink, distributes mechanical forces, and helps maintain the thermal interface gap. This multi-functionality reduces the overall number of components needed in the mounting arrangement.
2Manufacturing precision
If traditional attachment mechanisms are used, then thermal interface gap can be maintained, but the mounting arrangement takes up valuable space
Solution Approach 1:
By merging the mounting function into the stiffener and biasing member arrangement, the patent eliminates the need for additional hardware components that would occupy space. The biasing member applies force directly through the stiffener to maintain the thermal interface gap, creating a compact mounting arrangement that consumes minimal valuable space on the circuit board.
3Temperature
If attachment mechanism applies force to maintain thermal interface gap, then heat dissipation is improved, but mechanical stress on electronic component increases
Solution Approach 1:
The stiffener acts as an intermediary element between the biasing member and the module assembly. It distributes the mechanical force applied by the biasing member across a larger area of the circuit board and module, preventing concentrated stress on the electronic component while still maintaining adequate pressure for thermal contact between the heatsink and module.
Solution Approach 2:
The stiffener is positioned and designed to provide localized force distribution at critical stress points. By strategically placing the stiffener and biasing member, the patent applies force selectively to maintain thermal contact where needed while avoiding excessive stress on sensitive electronic components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a compact, cost-effective method to efficiently couple a heatsink to a circuit for heat dissipation, reducing thermal resistance and mechanical stress on electronic components while maintaining uniform thermal interface gaps.
Implementation Method 1
heatsink abutting the module on a side of the module opposite a side at which the circuit board is disposed
Implementation Method 2
heat dissipation as air passes over the heatsink
Implementation Method 3
a first biasing member biasing the heatsink relative to the stiffener towards the center of the module
Data Source
AI summary
Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.