Module Cover Forming Area Minimizes Heat Transfer to OLED Display Panel
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Solution Overview
Problem
Display devices, particularly those using organic light-emitting diodes (OLEDs), face challenges in minimizing heat transfer to the display panel, which can lead to overheating and potential deformation.
Innovation Solution
Incorporating a module cover with a forming area that maintains a distance from the plate, featuring protruding portions, rigid reinforcement bars, and conductive materials to distribute heat away from the display panel, while using adhesive tapes and connecting holes for electronic component attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a module cover is positioned close to the display panel for structural compactness, then device thickness is reduced, but heat transfer to the display panel increases causing overheating
Solution Approach 1:
A plate is introduced as an intermediary component between the module cover and the display panel. This plate serves as a heat blocking barrier that prevents heat generated by electronic components in the module cover from transferring to the display panel, while still allowing the overall device structure to remain compact
Solution Approach 2:
The module cover is divided into different regions: a forming area that maintains distance from the display panel to reduce heat transfer, and other areas that can be positioned closer. This segmentation allows selective heat management while maintaining structural compactness
2Device complexity
If the module cover is positioned close to the display panel, then structural compactness is improved, but heat transfer towards the display panel increases
Solution Approach 1:
The plate acts as a mediator that blocks heat transfer pathways from the module cover to the display panel, enabling compact structural design without the harmful effect of heat accumulation
Solution Approach 2:
The module cover is designed with a forming area that has different spatial characteristics - specifically, this area maintains a greater distance from the display panel compared to other regions, creating localized heat management zones
3Reliability
If adhesive tape is applied across the entire module cover for component attachment, then fastening reliability is improved, but heat transfer to the display panel increases
Solution Approach 1:
Adhesive tape is applied selectively only in non-forming areas of the module cover, away from the forming area that is positioned over the display panel. This localized application strategy ensures reliable component attachment while preventing heat transfer pathways through the adhesive
Solution Approach 2:
The module cover is segmented into a forming area (where no adhesive is applied) and non-forming areas (where adhesive can be applied). This spatial segmentation allows differential treatment of regions based on their functional requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes heat transfer to the display panel, preventing overheating and ensuring the longevity of the OLED panel by distributing heat and maintaining structural integrity.
Implementation Method 1
a plate, a module cover disposed on the other side of the plate with respect to the display panel
Implementation Method 2
The module cover may be made of conductive material
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3(a)~3(b)
AI summary
A display device is disclosed. The display device of this invention includes: a display panel; a plate whose one side is attached to the rear surface of the display panel; a module cover including a forming area that is projected and recessed in at least some part to keep a distance from the plate; and a housing attached to the module cover. According to the present invention, it is possible to minimize heat transfer towards the display panel by including a module cover where a forming area is provided to keep a distance from a plate.