Electronic Module with Accessible Discrete Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing complexity and area extent of semiconductor component housings lead to space requirements issues on higher-level circuit boards and difficulties in accessing and replacing discrete components embedded in plastic housing compounds, making it challenging to meet customer-specific demands and maintain process control.
Innovation Solution
An electronic module design that includes a semiconductor chip and structured metal plate on the component housing's upper face, allowing for customer-specific arrangement of discrete components without additional space on the circuit board, with the metal plate's lead interconnects and contact pads accessible for fitting and replacement, and a method for producing this module that embeds the semiconductor chip and connection elements in a plastic housing compound while keeping the metal plate's upper face accessible.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If discrete components are embedded in a common plastic housing compound for the semiconductor component housing, then the space required by the electronic module increases, but access to the embedded discrete components becomes virtually impossible after embedding
Solution Approach 1:
The patent segments the housing structure by providing a recess in the plastic housing compound that exposes the discrete components. This allows the housing to be divided into an embedded portion (for structural integration) and an accessible portion (for component access), resolving the contradiction between space efficiency and accessibility.
Solution Approach 2:
The patent introduces a vertical dimension solution by creating a recess that exposes the discrete components at a different depth level. This allows components to be embedded in the plastic housing compound while remaining accessible through the recess, effectively using the third dimension (depth) to resolve the access problem.
2Reliability
If discrete components are fitted before the connection of the semiconductor chip to the circuit carrier, then there is a risk of contamination for the contact pads, but if fitted after, there is a risk of damage to connection elements during handling
Solution Approach 1:
The patent applies preliminary action by fitting the discrete components into the recess before the semiconductor chip is connected to the circuit carrier. The recess structure protects the connection elements from damage during subsequent handling, while the timing of operations is carefully controlled to prevent contamination of contact pads.
3Area of stationary object
If the area extent of semiconductor component housings increases to accommodate complex integrated circuits, then the space requirement on higher-level circuit boards increases, but customer-specific demands for different discrete components cannot be provided
Solution Approach 1:
The patent creates a universal platform by providing a standardized recess structure in the housing that can accommodate various discrete components. This allows the same housing design to serve multiple customer-specific configurations, enhancing adaptability without increasing the overall area extent of the semiconductor component housing.
Data Source
AI summary
An electronic module includes a component housing and at least one semiconductor chip. The semiconductor chip is arranged on a circuit carrier in the component housing. The semiconductor chip is connected to an upper face of the circuit carrier via connection elements. In this case, the semiconductor chip, the connection elements and, partially, the circuit carrier are embedded in a plastic housing compound. A metal plate which is structured into lead interconnects and contact connecting pads is provided on the upper face of the component housing.