Electronics Module Edge Interconnects on Thermoformable Film
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Solution Overview
Problem
Existing methods for integrating electronic components onto substrates result in complex and costly electrical connections, often requiring laborious assembly processes that compromise reliability and cost-effectiveness.
Innovation Solution
A method involving direct attachment of electronics modules to a thermoformable film substrate using electrically conductive joint materials, such as solder or conductive adhesive, allowing for electrical connections via the module's edges or top, and optionally embedding the module in an injection-molded material layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional assembly methods are used, then assembly capability is limited to standard configurations, but flexibility and adaptability to different device requirements deteriorate
Solution Approach 1:
The assembly system is divided into modular components: a base plate, adjustable support structures, and interchangeable assembly heads. Each module can be independently configured and repositioned to accommodate different device geometries and assembly requirements, enabling flexible adaptation without redesigning the entire system.
Solution Approach 2:
The assembly system incorporates adjustable and reconfigurable elements such as movable support arms, variable positioning mechanisms, and programmable robotic end-effectors. These dynamic components allow the system to adapt its configuration in real-time based on the specific device being assembled, providing versatility while maintaining controlled complexity through automated adjustment.
2Productivity
If traditional assembly processes are used, then manufacturing time is long, but productivity increases
Solution Approach 1:
Components are pre-positioned, pre-aligned, and pre-assembled in standardized modules before being transferred to the final assembly station. Fasteners, connectors, and sub-assemblies are pre-prepared and staged in automated feeders, eliminating time-consuming manual preparation during the assembly process and increasing throughput.
Solution Approach 2:
The assembly system operates as a continuous automated flow where components are constantly fed, assembled, and transferred without interruption. Multiple assembly stations work in parallel on different components simultaneously, and robotic systems perform multiple operations in continuous sequences, maximizing productivity while minimizing idle time through optimized material handling and synchronized operations.
Data Source
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AI summary
A method for manufacturing an electronics assembly (100), comprising obtaining or producing (210) an electronics module (10), wherein the electronics module (10) comprises a first circuitry (12) on a first surface at a first side of a circuit board (11), at least one electronics component (12) on the circuit board (11) and in electrical connection with the first circuitry (13), and at least one first connection portion (14) on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board (11), wherein the at least one first connection portion (14) is electrically connected to or is comprised in the first circuitry (12). The method also comprises arranging (220) the electronics module (10) on a second substrate (21), such as on a thermoformable film or sheet, preferably of plastic material, comprising a second connection portion (22) connected to a second circuitry (23) on a surface of the second substrate (21), wherein a second surface of the circuit board (11), being on the opposite second side than the first surface, faces the second substrate (21), and arranging (230) electrically conductive joint material (16) onto the first (14) and the second connection portions (22) to extend between them for electrically connecting the electronics module (10) to the second circuitry (23) via the electrically conductive joint material (16).