Electronic Module Frame Member Adhesive Containment Design
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Solution Overview
Problem
The existing techniques for adhering glass to a mold in electronic modules often result in adhesive leakage and spread, leading to faults in the image, which complicates the design and manufacturing process due to the need to adjust coating amounts, curing conditions, and viscosity of the adhesive.
Innovation Solution
An electronic module design featuring a frame member with a support portion that includes a contact portion and a concave portion to house a coupling member, which suppresses the spread of the adhesive by providing a controlled space for the adhesive between the contact portion and the inner edge of the support surface, ensuring stable positioning and coupling of the transmissive and frame members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to couple the transmissive member and frame member, then the coupling strength is improved, but adhesive leakage and spread occur causing image faults
Solution Approach 1:
The support surface is designed with different local regions: a contact portion for adhesive application and a non-contact portion extending along the outer edge of the main surface where adhesive is prevented from spreading. This local differentiation allows the adhesive to be contained in the intended area while maintaining coupling strength.
Solution Approach 2:
The support surface is segmented into distinct functional zones: the contact portion where adhesive is applied and the non-contact portion that acts as a barrier. This segmentation prevents adhesive from spreading across the entire surface while ensuring proper coupling at the contact area.
2Object-affected harmful factors
If adhesive coating amount and curing conditions are adjusted to suppress adhesive spread, then adhesive leakage is reduced, but the design and manufacturing complexity increases
Solution Approach 1:
The function of controlling adhesive spread is extracted from the adhesive formulation and curing process, and instead is implemented through the structural design of the support surface. This transfers the control mechanism from chemical/process parameters to geometric design, simplifying manufacturing.
Solution Approach 2:
The non-contact portion of the support surface acts as an intermediary barrier between the adhesive and the outer edge of the main surface. This physical barrier mediates the adhesive flow, preventing spread without requiring complex adjustments to adhesive properties or curing conditions.
3Strength
If the adhesive coupling method is used, then the transmissive member and frame member can be coupled, but positional stability varies with adhesive property changes
Solution Approach 1:
The support surface design creates a localized adhesive application area with defined boundaries. This ensures that adhesive remains within the contact portion regardless of variations in adhesive properties, maintaining consistent positional stability between the transmissive member and frame member.
Data Source
AI summary
An electronic module including an electronic device including a pixel region, a transmissive member including a main surface facing the pixel region, and a frame member coupled to the electronic device and the transmissive member and deciding a positional relationship between the electronic device and the transmissive member is provided. The frame member includes a support portion arranged to surround the transmissive member and having a support surface that supports the transmissive member. The support surface includes a contact portion contacting the main surface, and a concave portion which is depressed more than the contact portion and in which a coupling member configured to couple the transmissive member and the frame member is arranged. The contact portion includes, between the concave portion and an inner edge of the support surface, a portion extending along an outer edge of the main surface.