Electronic Module Frame Layout for Heat Dissipation and Component Insulation
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Solution Overview
Problem
Electronic modules face challenges in managing heat transfer to components, leading to performance degradation, lifespan reduction, and damage due to inadequate adiabaticity, especially in high-heat environments.
Innovation Solution
The electronic module design incorporates a substrate with a frame member featuring high-thermal-conductivity and low-thermal-conductivity materials, where the high-conductivity member is positioned to face the peripheral region of the substrate and the low-conductivity member is placed between the high-conductivity member and components, inhibiting heat transfer to the components while maintaining effective heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a frame member with high thermal conductivity material is used to improve heat radiation performance, then heat radiation performance is improved, but heat transfer to mounted components increases causing performance degradation and damage
Solution Approach 1:
The frame member is designed with different thermal conductivity properties in different regions: the first region (first direction) has high thermal conductivity for effective heat radiation, while the second region (second direction) has low thermal conductivity to provide adiabatic protection to components. This local differentiation allows simultaneous achievement of heat radiation performance and component protection.
Solution Approach 2:
The frame member is segmented into functionally distinct regions with different thermal conductivity characteristics. The first region is configured for heat dissipation while the second region is configured for thermal insulation, creating a segmented thermal management system within a single structural component.
2Reliability
If adiabaticity is enhanced to protect components from heat, then component reliability is improved, but heat radiation performance of the electronic module deteriorates
Solution Approach 1:
The frame member implements local quality differentiation by providing adiabatic properties only in the second region where components are mounted, while maintaining high thermal conductivity in the first region for heat radiation. This selective application of thermal properties resolves the contradiction between component protection and overall heat radiation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses heat transfer to components, enhancing the electronic module's heat radiation performance and preventing performance degradation, while ensuring efficient thermal conduction and durability.
Implementation Method 1
a low-thermal-conductivity member... positioned between the high-thermal-conductivity member and the components... inhibiting heat transfer to the components
Implementation Method 2
a high-thermal-conductivity member... positioned to face a peripheral region of the substrate... efficient thermal conduction
Data Source
AI summary
An electronic module comprises a substrate including a first surface and a second surface on a side opposite to the first surface, the second surface including a first region and a second region surrounding the first region, an electronic device attached to the first surface, a component attached to the first region of the second surface, a lid member positioned to face the electronic device, and a frame member attached to the substrate to support the lid member. A first member and a second member having a higher thermal conductivity than the first member are disposed at least on the second surface. At least a part of the second member is positioned to face the second region. At least a part of the first member is positioned between the second member and the component.