Semiconductor Module Frame Extension for Cooler Insulation Gaps

An extension portion made of electrically insulating material is introduced as an intermediary element between the semiconductor module and the cooler. This extension portion extends from the outer peripheral wall of the frame toward the semiconductor module, providing an additional insulation barrier that compensates for potential voids or unfilled portions in the sealing member, thereby ensuring reliable insulation between the main terminal and the cooler.

The insulation structure is extended into the vertical dimension by adding the extension portion that protrudes from the frame toward the semiconductor module. This creates a multi-layered insulation approach where the extension portion provides insulation in the vertical direction, complementing the horizontal insulation provided by the sealing member, thus addressing insulation reliability from multiple spatial dimensions.

Instead of increasing the horizontal distance between the main terminal and the cooler, the extension portion utilizes the vertical dimension by protruding from the frame toward the semiconductor module. This vertical extension provides additional insulation distance without significantly increasing the horizontal footprint of the device, thus maintaining compact overall dimensions while enhancing insulation reliability.

The extension portion is strategically positioned only in the regions where insulation is most critical - specifically between the main terminal and the cooler. This localized approach provides enhanced insulation exactly where needed without unnecessarily increasing the overall device volume, maintaining compact dimensions while ensuring reliable insulation in critical areas.