Multi-Level Heat Dissipation Structure for Electronic Modules
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Solution Overview
Problem
Existing heat dissipation structures in electronic modules are inefficient due to long heat transmission paths through heat conductive bumps, leading to inadequate heat dissipation and potential damage to components from temperature fluctuations.
Innovation Solution
A module design featuring a substrate with a sealing resin layer containing recesses for heat-dissipating members, where the first heat-dissipating portion is spaced apart from components and includes an overlap area larger than the second heat-dissipating portion, allowing for immediate heat transfer and reduced component damage, while the second heat-dissipating portion has a smaller surface area to prevent heat transfer to non-heat-generating components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the heat sink is disposed on the upper surface of the mold resin, then the structure is simple, but the heat transmission distance is long and heat dissipation effect is insufficient
Solution Approach 1:
The patent transitions from a single-level heat dissipation structure to a multi-level structure by creating recesses in the mold resin. The heat conductive bumps are positioned in these recesses, allowing heat transmission paths to extend in the vertical dimension while maintaining a compact overall footprint. This dimensional change reduces the effective heat transmission distance without complicating the horizontal layout.
Solution Approach 2:
The patent embeds the heat conductive bumps within recesses formed in the mold resin, creating a nested configuration where the bumps are partially embedded in the resin matrix. This nesting approach allows the heat dissipation structure to be integrated within the existing mold resin volume, reducing the overall distance from components to heat sink while maintaining structural simplicity.
2Reliability
If the heat conductive bumps are made long to reach the heat sink, then the heat transmission path is established, but the heat transmission time increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent applies local quality by creating recesses specifically in the regions where heat conductive bumps need to be positioned. These localized recesses optimize the heat transmission path in critical areas without affecting the overall structure. The recesses are strategically placed to reduce heat transmission distance only where necessary, maintaining reliability while reducing heat transmission time.
3Reliability
If the first heat-dissipating portion is spaced apart from the component, then the component is protected from damage, but the heat transmission distance increases
Solution Approach 1:
The patent introduces the sealing resin layer as an intermediary between the heat-dissipating portions and the electronic components. This intermediary material provides thermal coupling while maintaining physical spacing, allowing heat to be transmitted efficiently without the heat-dissipating portions directly contacting the components. The sealing resin thus mediates between the need for component protection and heat transmission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by reducing the distance for heat transfer and minimizing the impact on non-heat-generating components, thereby preventing characteristic fluctuations and damage due to temperature rises.
Implementation Method 1
the second heat-dissipating portion extends from a surface of the first overlap portion facing the first component toward the opposite surface of the first component
Implementation Method 2
a heat-dissipating member that includes a first heat-dissipating portion and a second heat-dissipating portion
Data Source
AI summary
A module includes a substrate, a first component on a first main surface of the substrate and from which heat is to be dissipated, a sealing resin layer that encloses the first component, and a heat-dissipating member that includes a first and a second heat-dissipating portions. The first heat-dissipating portion is disposed in the sealing resin layer, spaced apart from an upper surfaces of the first component, and includes a first overlap portion that overlaps an upper surfaces of the first component when viewed in plan in a direction perpendicular to the first main surface. The second heat-dissipating portion extends from an undersurface of the first overlap portion to the upper surface of the first component. An area of the second heat-dissipating portion on a surface of the first overlap portion including the undersurface is smaller than an area of the first overlap portion.