Redistribution Layer Module Structure for Heat Dissipation
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Solution Overview
Problem
Existing modules face challenges in efficiently dissipating heat generated by components mounted on substrates, which can lead to reduced performance and reliability.
Innovation Solution
A module design that includes a substrate with a first surface, a first component mounted on the surface, a first sealing resin layer covering the component, and a redistribution layer on top of the resin layer. The redistribution layer features a first metal film corresponding to the component's projection area, an insulating film covering the metal film, and a group of conductor vias passing through the insulating film and protruding from the metal film, allowing heat to be efficiently dissipated to the outside.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are mounted on a substrate, then functionality is achieved, but heat generation occurs which reduces reliability
Solution Approach 1:
The patent extracts the heat dissipation function from the substrate and creates a separate redistribution layer with dedicated thermal conduction paths. The conductor vias and metal films form an independent heat transmission network that separates the mounting function (substrate) from the heat dissipation function (redistribution layer), allowing heat to be efficiently removed from components without interfering with their electrical connections.
Solution Approach 2:
The redistribution layer acts as an intermediary between the heat-generating components and the external environment. The conductor vias and metal films serve as intermediate heat transmission media, conducting heat from component mounting surfaces through the sealing resin layer to exposed surfaces, thereby mediating the heat transfer process and preventing direct heat accumulation at component locations.
2Ease of manufacture
If a simple substrate structure is used, then manufacturing is easier, but heat dissipation performance is insufficient
Solution Approach 1:
The patent transitions from planar heat dissipation (two-dimensional) to three-dimensional heat management by stacking multiple functional layers. The redistribution layer with conductor vias extending through the sealing resin layer creates vertical heat transmission paths, adding a third dimension to heat dissipation and significantly increasing the surface area available for heat removal without complicating the basic substrate manufacturing process.
Solution Approach 2:
The patent employs composite material structures combining different functional layers: conductive metal films for heat transmission, insulating sealing resin layers for protection, and conductor vias for thermal pathways. This composite approach allows each material to optimize its specific function while working together to achieve superior overall heat dissipation performance without requiring complete redesign of the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed module design effectively transmits heat from the components to the redistribution layer, where it can be quickly dissipated to the outside, thereby improving heat dissipation performance and maintaining component operation within normal parameters.
Implementation Method 1
the heat generated in the first component is transmitted to the first group of conductor vias through the first metal film
Data Source
AI summary
A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin layer disposed to cover a side surface of the first component and the first surface; and a redistribution layer covering a surface of the first sealing resin layer on a side far from the substrate. The redistribution layer includes: a first metal film disposed to correspond to a projection area of the first component; a first insulating film covering a surface of the first metal film on a side far from the substrate; and a first group of conductor vias passing through the first insulating film and protruding from the first metal film in a direction away from the substrate.