Power Semiconductor Module-Heatsink Joint for Low-Load Swaging
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Solution Overview
Problem
Existing power semiconductor devices face issues with increased necessary load and thermal contact resistance due to manufacturing variations, such as position deviation and dimensional errors, which can lead to a decrease in swaging joint strength.
Innovation Solution
A power semiconductor device design featuring a module base and heatsink base with specific surface shapes, including protrusions and recesses, where one protrusion's tip end is away from its corresponding recess, allowing for controlled surface pressure and reduced plastic deformation during swaging, thereby maintaining joint strength and thermal contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the design of protruding-recessed portion is adjusted to reduce necessary load, then necessary load for swaging is reduced, but strength of swaging joint decreases and thermal contact resistance increases
Solution Approach 1:
The attachment surface is divided into multiple protruding-recessed portions, with at least one protrusion having its tip end away from the corresponding recess. This segmentation allows different regions to serve different functions: some provide alignment guidance while others contribute to joint strength, resolving the contradiction between reducing necessary load and maintaining joint strength
Solution Approach 2:
Different protrusions are designed with different characteristics - some have tip ends in contact with recesses (providing alignment function), while others have tip ends away from recesses (providing both alignment and strength contribution). This local differentiation allows the structure to simultaneously reduce necessary load through alignment while maintaining joint strength through additional contact areas
2Manufacturing precision
If precise alignment process is performed before swaging, then position deviation is suppressed, but manufacturing complexity and burden increase
Solution Approach 1:
The protruding-recessed portions are pre-formed on the module base and heatsink base before swaging. These pre-formed features automatically provide alignment guidance during the swaging process, eliminating the need for separate precise alignment operations and reducing manufacturing complexity while maintaining positioning accuracy
Solution Approach 2:
The protruding-recessed portions serve dual functions: they provide alignment guidance and contribute to joint strength. The structure itself performs the alignment function without requiring external alignment devices or processes, allowing the system to self-align during swaging and reducing overall manufacturing burden
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses the increase in necessary load and thermal contact resistance while enhancing productivity and reliability by allowing larger position deviations and reducing manufacturing complexity.
Implementation Method 1
reduced plastic deformation during swaging
Implementation Method 2
allowing for controlled surface pressure
Implementation Method 3
swaging is performed on the recess and the protrusion in order to integrate the metal component and the heat dissipation member
Data Source
AI summary
A first surface shape of a module base and a second surface shape of a heatsink base are fitted to each other, and thus the module base and the heatsink base are fixed to each other. One of the first surface shape and the second surface shape includes a first protrusion and a second protrusion, and the other includes a first recess fitted to the first protrusion and a second recess fitted to the second protrusion. The first protrusion has a tip end in contact with the first recess, and the second protrusion has a tip end away from the second recess.