Power Semiconductor Module Housing With Detachable Sidewall Connections

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Solution Overview

Problem

Conventional power semiconductor module arrangements require extensive developmental effort and a large number of manufacturing steps, leading to high costs.

Innovation Solution

A power semiconductor module arrangement featuring a substrate with aligned metallization layers and recessed sidewalls that accommodate connection elements, allowing for a detachable and reduced number of manufacturing steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contact elements are arranged on the substrate and protrude through the housing cover requiring insertion through printed circuit board through holes, then electrical connection is achieved, but developmental effort and manufacturing steps increase significantly

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the housing cover and the electrical connection interface into a single integrated structure. The connection elements are mounted on the substrate and extend through the housing cover, which is formed as an integral part of the housing. This merging eliminates the need for separate through-hole insertion steps in external circuit boards, reducing manufacturing complexity while maintaining reliable electrical connection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing cover serves multiple functions: it provides mechanical protection for the internal components and simultaneously acts as the interface structure for electrical connections. The connection elements protruding through the cover integrate the sealing function and the electrical interface function into a single universal structure, reducing the number of separate components and manufacturing steps required.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If extensive developmental effort and large number of manufacturing steps are used for conventional arrangements, then reliable electrical connection is achieved, but production costs increase

Engineering Contradiction:

Improveelectrical connectionVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the housing cover structure with the electrical connection interface, eliminating the need for separate through-hole processing and assembly steps in external circuit boards. This integration reduces manufacturing steps and associated costs while maintaining reliable electrical connection through the protruding connection elements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The connection elements are pre-mounted on the substrate and extend through the housing cover during the module assembly process. This preliminary arrangement of connection elements eliminates the need for subsequent through-hole insertion and soldering operations, reducing both manufacturing complexity and production costs while ensuring reliable electrical connection.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If conventional power semiconductor module arrangements are used, then functional requirements are met, but developmental effort and manufacturing complexity remain high

Engineering Contradiction:

Improvefunctional requirementVSAvoiddevelopmental effort

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent integrates the housing cover and electrical connection interface into a single unified structure. The connection elements are mounted on the substrate and extend through the housing cover, which is formed as an integral part of the housing. This merging reduces developmental effort by eliminating the need to design and manufacture separate connection interfaces and through-hole structures.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentEP3627978B1Power semiconductor module arrangement and housing for a power semiconductor arrangement

Publication Date: 2026.01.14 INFINEON TECHNOLOGIES AG

Figure 1~2
Figure 3A~4
Figure 5~6B

AI summary

A power semiconductor module arrangement comprises a substrate comprising a dielectric insulation layer, a first metallization layer arranged on a first side of the dielectric insulation layer, and a second metallization layer arranged on a second side of the dielectric insulation layer, wherein the dielectric insulation layer is disposed between the first and the second metallization layer. The arrangement further comprises at least one first connection element mounted on the substrate, a housing comprising sidewalls, and at least one second connection element. Each second connection element comprises a first part extending vertically through a sidewall of the housing, a second part coupled to a first end of the first part and protruding from the sidewall in a vertical direction, and a third part coupled to a second end of the first part opposite the first end. Each third part is detachably coupled to one of the at least one first connection element.